Direct Liquid Jet-Impingment Cooling With Micron-Sized Nozzle Array and Distributed Return Architecture

Microjet Cooler with Distributed Returns

“…Case C data projects a convection coefficient of 0.064 MW/m2K (Nu = 12.8) for jet velocity equal to 2 m/s (Re = 252). Scaling the Nusselt number prediction using Reynolds number with 0.73 exponential dependency (reported [10] for equivalent fluid flow conditions) yields Nu = 10.7 for Re = 198 and validates the use of this particular CFD code to project thermal performance for these devices, as the deviation between the experimental data and the model is just ∼ 3%. Because our MLC technology can produce ceramic products with internal feature dimensions considerably smaller than the ones used in the tested cooler, it is important to explore the potential thermal improvement for a cooler designed with higher jet density.…”

A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics

“…A variety of heat sink designs have been employed to dissipate larger heat fluxes by delaying CHF or reducing the pressure drop in two-phase operation compared to a conventional design with straight, parallel channels fed by a single header. These designs have implemented one or more of features such as vapor venting [10], pin-fins and interrupted channels of various shapes and configurations [10][11][12], wick structures to aid in thin film evaporation [13][14][15], microchannels with reentrant cavities and/or inlet restrictors [16], microgaps [17], arrays of jets [18][19][20][21], diverging channels [22,23], microchannels fed with tapered manifolds [24], and stacked heat sinks [25]. Heat fluxes as high as 1127 W/cm² have been dissipated with dielectric fluids [26] using a 10 mm × 20 mm copper heat sink that incorporated both flow boiling in microchannels and jet impingement.…”

GreenCool: An Energy-Efficient Liquid Cooling Design Technique for 3-D MPSoCs Via Channel Width Modulation

“…More recently, back-side water-based liquid cold plates (such as staggered microchannel and distributed return jet plates) are developed for IC cooling, which can handle up to 400 W/cm 2 in single-chip applications [20]. Prototypes of 3-D chips with interlayer microchannel heat sinks have been shown to handle up to 250 W/cm 2 of hot spot heat fluxes, demonstrating the scalability of interlayer liquid cooling [8], [9].…”