Development of SnAg-based lead free solders in electronics packaging

Zhang, Liang; He, Chengwen; Guo, Yong-huan; Han, Junyu; Zhang, Yong‐Wei; Xu-yan, Wang

doi:10.1016/j.microrel.2011.10.006

Cited by 99 publications

(31 citation statements)

References 153 publications

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“…A short pasty range provides a faster solidification of the solder and it is important in providing better grain refinement and was observed for the SAC solder alloy [32][33][34]. This result was supported by the research of [30,35]. Related to that, rapid solidification provides better and much effective grain fined microstructure of the solder that can enhance the strength directly than the slow cooling rate [12].…”

Section: Melting Propertiesmentioning

confidence: 85%

A Study of Temperature, Microstructure and Hardness Properties of Sn-3.8Ag-0.7Cu (SAC) Solder Alloy

Singh

Noor

2015

MATEC Web of Conferences

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Abstract. Solder alloys are one of the most crucial aspect linking the electrical components to the printed circuit board PCB substrate. Thus, producing a good solder is a must to say in electronic industries. Among major functions of solder alloys are to provide beneficial properties in melting, microstructure and mechanical strand. In this aspect, the Sn-3.8Ag-0.7Cu (SAC) solder alloys are recommended as potential candidate to assure these benefits. In this study, the solder possesses melting temperature of, T M=227°C which is below the desired soldering temperature, T M=250°C. Besides, this SAC solder produces well-defined microstructures with Sn-matrix and eutectic phase consisting Cu 6Sn5 and Ag3Sn displayed from SEM image, contributes in harvesting good mechanical properties. The SAC solder also provides a high hardness value with an average of 14.4Hv for Vickers hardness. All these results seem to satisfy the need of a viable solder alloy.

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Section: Melting Propertiesmentioning

confidence: 85%

A Study of Temperature, Microstructure and Hardness Properties of Sn-3.8Ag-0.7Cu (SAC) Solder Alloy

Singh

Noor

2015

MATEC Web of Conferences

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“…Metallic nanoparticles, e.g., Ag, Au, and Cu, are ideal solder materials for low-temperature interconnection [18,153,466]. The addition of ZrO 2 nanoparticles can refine the size of SnAg-based lead-free solders due to the adsorption effect of nanoparticles [487]. …”

Section: Applications Electronicsmentioning

confidence: 99%

Application of Nanoparticles in Manufacturing

Hu¹,

Tuck²,

Wildman³

et al. 2015

Handbook of Nanoparticles

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With the development of nanoscience and nanotechnology, manufacturing is undergoing revolutionary changes. Nanoparticles, due to their novel and often enhanced properties, are now more and more used in manufacturing. In this chapter, the state-of-the-art application of nanoparticles in manufacturing is reviewed. The contents include five parts: (a) role of nanoparticles in manufacturing, (b) manufacturing methods, (c) applications, (d) challenges, and (e) conclusions. The roles of nanoparticles are divided into three categories: (i) building blocks, being the major component of a manufactured product by solid-state or colloidal nanoparticle consolidation; (ii) functional filler, as an addition for functionality, such as property improver, catalyst, stimuli-responsive, sensing, imaging, and carrier; and (iii) nanocomposites for multifunctionality. Various manufacturing methods and novel trends are summarized in this chapter, including top-down and bottom-up, from 2D to 3D, from cleanroom to desktop, 3D printing, and bio-assisted methods, such as DNA origami. Direct applications in areas of flexible electronics, molecular electronics, solar cells, construction industry, water treatment, and biomedical devices are presented. The associated challenges including nanoparticle safety issue, sustainable manufacturing, economic issue, and scale-up are discussed. Role of Nanoparticles in ManufacturingWith the development of nanoscience and nanotechnology, manufacturing is undergoing revolutionary changes. Nanoparticles, due to their novel and often enhanced properties, have more and more been used in various manufacturing applications. Their role can generally be divided into three categories: (a) building blocks, (b) functional filler, and (c) nanocomposites for multifunctionality, which is summarized in Table 1. Building BlockNanoparticles sometimes act like the bricks in a house-building process to be the main component of a manufactured product. They can be consolidated via solid-and liquid-based methods. Solid-State Nanoparticle ConsolidationSolid-state metallic, ceramic, amorphous, and compound particles can be thermomechanically processed to form bulk 2D/3D structures with desired strength and level of densification (even full densification is possible). Reported methods include powder compact forging/extrusion, equal channel angular extrusion/ pressing, and hot pressing/sinter forging combined with conventional heating, laser sintering, microwave sintering, electric discharge sintering, or spark plasma sintering [33,255,278,306,425,426,476,492]. Particles with a narrow size distribution and spherical shape are desired to achieve low pore-to-

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“…Ni, Cu, Ag, Al 2 O 3 , ZrO 2 , Carbon nanotubes and graphene), our research group prepared a novel reinforcement material-Ni-coated graphene, by means of an electroless plating method [16]. This composite reinforcement is expected to provide a solution to certain disadvantages of using metal (for example coarsening during thermal ageing) and nonmetal reinforcement (hardly to be reactively wetted by molten solder) [17][18][19]. The Ni nanoparticles deposited upon the surface of GNS could serve as a 'bridge', which could link the GNS sheets and solder matrix by forming a Ni-containing IMC around the GNS.…”

Section: Introductionmentioning

confidence: 99%

Microstructural evolution of 96.5Sn–3Ag–0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradient

Chen

Liu

Silberschmidt

et al. 2018

J Mater Sci: Mater Electron

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In this study, 96.5Sn-3Ag-0.5Cu (SAC305) lead-free composite solder containing graphene nanosheets (GNS) decorated with Ni nanoparticles (Ni-GNS) was prepared using a powder metallurgy method. A lab-made set-up and a corresponding Cu/ solder/Cu sample design for assessing thermo-migration (TM) was established. The feasibility of this setup for TM stressing using an infrared thermal imaging method was verified; a temperature gradient in a solder joint was observed at 1240 K/cm. Microstructural evolution and diffusion of Cu in both plain and composite solder joints were then studied under TM stressing conditions. Compared to unreinforced SAC305 solder, the process of diffusion of Cu atoms in the composite solder joint was significantly reduced. The interfacial intermetallic compounds (IMCs) present in the composite solder joint also provide a more stable morphology after the TM test for 600 h. Furthermore, during the TM test, the Ni-GNS reinforcement affects the formation, migration and distribution of Ni-Cu-Sn and Cu-Sn IMCs by influencing the dissolution rate of Cu atoms.

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Development of SnAg-based lead free solders in electronics packaging

Cited by 99 publications

References 153 publications

A Study of Temperature, Microstructure and Hardness Properties of Sn-3.8Ag-0.7Cu (SAC) Solder Alloy

A Study of Temperature, Microstructure and Hardness Properties of Sn-3.8Ag-0.7Cu (SAC) Solder Alloy

Application of Nanoparticles in Manufacturing

Microstructural evolution of 96.5Sn–3Ag–0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradient

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