Microstructural evolution of 96.5Sn–3Ag–0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradient

Chen, Guang; Liu, Li; Silberschmidt, Vadim V.; Liu, Changqing; Wu, Fengshun; Chan, Y. C.

doi:10.1007/s10854-017-8489-7

Cited by 14 publications

(4 citation statements)

References 21 publications

(28 reference statements)

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“…This is due to their good mechanical properties, adequate wettability, and acceptable melting temperature. Among these SnAgCu solders, the Sn-3.0Ag-0.5Cu (SAC305) alloy has become the benchmark solder as it can be utilized in a wide array of electronic devices [5,6].…”

Section: Introductionmentioning

confidence: 99%

Ag3Sn Compounds Coarsening Behaviors in Micro-Joints

et al. 2018

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As solder joints are being scaled down, intermetallic compounds (IMCs) are playing an increasingly critical role in the reliability of solder joints, and thereby an in-depth understanding of IMCs microstructure evolutions in micro-joints is of great significance. This study focused on coarsening behaviors of Ag3Sn compounds in Sn-3.0Ag-0.5Cu (SAC305) micro-joints of flip chip assemblies using thermal shock (TS) tests. The results showed that the Ag3Sn compounds grew and rapidly coarsened into larger ones as TS cycles increased. Compared with such coarsening behaviors during thermal aging, TS exhibited a significantly accelerating influence. This predominant contribution is quantitatively determined to be induced by strain-enhanced aging. Moreover, based on observations for Ag3Sn microstructure evolutions during TS cycling, one particular finding showed that there are two types of coarsening modes (i.e., Ostwald ripening and Necking coalescence) co-existing in the Ag3Sn coarsening process. The corresponding evolutions mechanism was elucidated in a combination of simulative analysis and experimental validation. Furthermore, a kinetic model of the Ag3Sn coarsening was established incorporating static aging and strain-enhanced aging constant, the growth exponent (n) was calculated to be 1.70, and the predominant coarsening mode was confirmed to be the necking coalescence.

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Section: Introductionmentioning

confidence: 99%

Ag3Sn Compounds Coarsening Behaviors in Micro-Joints

et al. 2018

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“…Sn-Pb alloys have been the primary solder alloys due to their excellent wettability, mechanical properties, and appropriate price [1][2][3][4][5]. However, Sn-Pb solders can no longer satisfy the demands of current industrial development due to increased environmental consciousness and the introduction of Restriction of Hazardous Substances (RoHS) and Waste Electrical and Electronic Equipment (WEEE) standards [6][7][8].…”

Section: Introductionmentioning

confidence: 99%

Investigation of the Microstructure, Thermal Properties, and Mechanical Properties of Sn-Bi-Ag and Sn-Bi-Ag-Si Low Temperature Lead-Free Solder Alloys

et al. 2023

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In this study, we investigated the microstructure, mechanical properties, and thermal performance of Sn-xBi-1Ag (x = 35, 37, 45, and 47 wt.%) solders, with a particular focus on the effect of adding trace Si atoms. The impact of different Ag concentrations on the properties of Sn-xBi-Ag-0.5Si solders was also studied. The results indicated that as the amount of Bi added to Sn-xBi-1Ag solder alloys increased, the tensile strength, microhardness, melting temperature, and melting range decreased somewhat, but the wettability improved. The Cu6Sn5 layer between the soldering alloy and the Cu substrate became thinner upon increasing the Bi content. Adding microcrystalline Si atoms to the Sn-Bi-1Ag alloy improved the tensile strength and microhardness, but the melting point and melting range were not significantly changed. The wettability was optimized, and the diffusion layer formed with the Cu matrix was significantly thinner. By increasing the Ag content in the Sn-Bi-(1,3)Ag-0.5Si alloy, the tensile strength of the alloy was continuously strengthened, while the hardness decreased slightly and the melting point and melting range increased slightly. The wettability was greatly improved, and the Cu6Sn5 layer became thinner.

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“…The properties of high voltage switch components material directly affect their service life and stability. Thus, developing copper matrix composites with good properties and arc erosion resistance is the key to solve the above problems [5][6][7].…”

Section: Introductionmentioning

confidence: 99%

Arc erosion behavior of TiB2/Cu composites with single-scale and dual-scale TiB2 particles

Guo

Zhang

et al. 2019

Nanotechnology Reviews

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Arc erosion behaviors of TiB2/Cu composites with single-scale and dual-scale TiB2 particles fabricated by powder metallurgy were studied. It was revealed that the dual-scale TiB2/Cu composites had fewer structure defects compared with the single-scale TiB2/Cu composites, and TiB2 particles with different size were uniformly distributed in the copper matrix. When the ratio of 2 μm over 50 μm TiB2 particles is 1:2, the density of TiB2/Cu composite is 98.5% and shows best mechanical and thermal properties. The arc duration and energy of TiB2/Cu composites increase with the increase of electric current in contact material testing. Compared with the single-scale TiB2/Cu composites, the arc erosion of dual-scale TiB2/Cu composite with 2 μm+50 μm (1:2) TiB2 was slighter. The anode bulge area and cathode erosion pit of dual-scale TiB2/Cu composite was smaller. The dual-scale TiB2 particles optimize the microstructure and thermal stability of the composite, which is conducive to alleviating arc erosion. The synergistic effect of different sized TiB2 particles in the matrix improved the arc erosion resistance of TiB2/Cu composite during arcing.

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Microstructural evolution of 96.5Sn–3Ag–0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradient

Cited by 14 publications

References 21 publications

Ag3Sn Compounds Coarsening Behaviors in Micro-Joints

Ag3Sn Compounds Coarsening Behaviors in Micro-Joints

Investigation of the Microstructure, Thermal Properties, and Mechanical Properties of Sn-Bi-Ag and Sn-Bi-Ag-Si Low Temperature Lead-Free Solder Alloys

Arc erosion behavior of TiB2/Cu composites with single-scale and dual-scale TiB2 particles

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