A Study of Temperature, Microstructure and Hardness Properties of Sn-3.8Ag-0.7Cu (SAC) Solder Alloy

Singh, Amares; Noor, Ervina Efzan Mhd

doi:10.1051/matecconf/20152702003

Cited by 6 publications

(4 citation statements)

References 37 publications

(48 reference statements)

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“…As can be seen, the value for lead free solders (LFS) results comparable with the obtained for eutectic Sn-Pb. In all cases, the values obtained for the Cu mold are bigger than the ones obtained for the sand mold, as cooling rate influence on the solidification microstructure, and therefore in the resulting mechanical properties (Singh and Mhd.Noor, 2015). At lower cooling speed the dendritic structure is coarse and so the microhardness was lower.…”

Section: Microhardness Evolution During Artificial Isothermal Agingmentioning

confidence: 81%

“…At lower cooling speed the dendritic structure is coarse and so the microhardness was lower. The microhardness also depends on the alloying elements, the higher the content and the greater the hardness value in the range of hipo-eutectic compositions, due to higher content of intermetallic phases Ag 3 Sn and Cu 6 Sn 5 (Miyazawa and Ariga, 1999;Singh and Mhd.Noor, 2015). Thus, the highest value was obtained for the ternary eutectic alloy Sn-3.5% Ag-0.9%.…”

Section: Microhardness Evolution During Artificial Isothermal Agingmentioning

confidence: 99%

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Influence of aging on microstructure and hardness of lead-free solder alloys

Morando

Fornaro

2020

SSMT

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Purpose The purpose of this paper is to carry out a study of the evolution of the microstructure and the microhardness of Sn-Cu-Ag alloys from as-cast condition and under artificial isothermal aging at different temperatures (100ºC and 180ºC) for a treatment time up to 500 h. A comparison with Sn-37% Pb eutectic solder samples was also made. Design/methodology/approach Sn-3.5%Ag, Sn-0.7%Cu and Sn-3.5%Ag-0.9%Cu were poured in two different cooling rate conditions and then aged at 100ºC (373ºK) and 180 °C (453ºK) during 500 h. Microstructural changes were observed by optical microscopy, scanning electron micrograph and energy dispersive X-ray microanalysis. Differential scanning calorimetry technique (DSC) was also used to confirm the obtained results. Findings A decrease up to 20% in microhardness respect to the value of the as-cast alloy was observed for both aging temperatures. These changes can be explained considering the coarsening and recrystallization of Sn dendrites present in the microstructures of all the systems studied. Originality/value There is no evidence of dissolution or precipitation of new phases in the range of studied temperatures that could be detected by DSC calorimetry technique. The acting mechanisms must be the result of coarsening of Sn dendrites and the residual stresses relaxation during the first stages of the isothermal aging.

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Section: Microhardness Evolution During Artificial Isothermal Agingmentioning

confidence: 81%

Section: Microhardness Evolution During Artificial Isothermal Agingmentioning

confidence: 99%

Influence of aging on microstructure and hardness of lead-free solder alloys

Morando

Fornaro

2020

SSMT

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“…The Vicker’s hardness of In-Sn alloys, plotted in Figure 5 , closely matches the trends of the UTS data displayed in Figure 3 . The highest hardness value, 11.43 Hv, was detected in In-80Sn, although it is noted that this is still lower than the 14.4 Hv associated with the Sn-3.8 wt%Ag-0.7 wt%Cu SAC solder alloy [ 25 ].…”

Section: Resultsmentioning

confidence: 99%

Mechanical Properties and Microstructure of Binary In-Sn Alloys for Flexible Low Temperature Electronic Joints

et al. 2022

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This research evaluates the mechanical properties of a variety of binary In-Sn alloys as potential candidates for low temperature electronic joints. The tensile and hardness tests of as-cast In-5Sn, In-12.5Sn, In-25Sn, In-30Sn, In-35Sn, In-40Sn, In-50Sn, In-60Sn, In-80Sn (wt.%) were assessed at room temperature and compared to those of pure In and Sn. The ultimate tensile strength (UTS) increased from 4.2 MPa to 37.8 MPa with increasing tin content in the alloys under the testing condition of 18 mm/min and the results showed little difference under a lower strain rate (1.8 mm/min). Most compositions showed good ductility in tensile testing with an average of 40% elongation. A melting point range of 119.3 °C to 194.9 °C for tested alloys was measured using differential scanning calorimetry (DSC). The microstructure investigated by scanning electron microscopy (SEM) was discussed with respect to the mechanical properties and it has been found that the presence of the Sn-rich γ-InSn4 phase in the microstructure has a significant impact on mechanical properties. The fundamental data from this study can be used for the development of new low temperature In-Sn alloys.

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“…The average shear strength result for the Sn-50Bi +2%TiO2 solder alloy is higher (42.40MPa) than the average shear strength of the Sn-50Bi solder alloy (40.78MPa). Among the crucial factor that affects the strength of any solder alloy and provides the solder the ability to withstand shear and tensile stresses is the intermetallic compound (IMC) layer formed between the solder alloy and the substrate [10].…”

Section: Advanced Materialsmentioning

confidence: 99%

Effect on Shear Strength and Hardness Properties of Tin Based Solder Alloy, Sn-50Bi, Sn-50Bi+2%TiO<sub>2</sub> Nanoparticles

Singh

Tchari

2020

AMR

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Solder alloys are important joining medium widely used in the electronics industry to connect components to printed circuit board PCB. The Sn-Pb solder alloys have been the cornerstone medium used for a long time. Unfortunately, the use of Pb was banned by the European Union due to the harmful environmental and health issues with Pb. Therefore, in this study, the Sn-50Bi and Sn-50Bi+2%TiO2 nanoparticles lead-free solder alloy is investigated based on their shear strength, Vickers hardness, and melting temperature. The investigation shows that the hypo eutectic Sn-50Bi has a low melting temperature of approximately 145°C, and the 2%TiO2 nanoparticles reinforced Sn-50Bi has a melting temperature of around 182°C, which is lower than the traditional Sn-Pb (Tm=183 °C) and Sn-Ag-Cu (Tm=227°C). Furthermore, the developed Sn-50Bi had a Vickers hardness and shear strength of 26.81 HV and 40.78 MPa respectively, higher than the other leaded and lead-free solders. However, after the reinforcement, the hardness increased by 12% (30 HV) and a slight increase of 2.5% (42.4MPa) in shear strength. Overall, the addition of the TiO2 nanoparticles showed a clear influence on the Sn-Bi properties. The results obtained from this study seem satisfactory to the electronic industry and the environment.

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A Study of Temperature, Microstructure and Hardness Properties of Sn-3.8Ag-0.7Cu (SAC) Solder Alloy

Cited by 6 publications

References 37 publications

Influence of aging on microstructure and hardness of lead-free solder alloys

Influence of aging on microstructure and hardness of lead-free solder alloys

Mechanical Properties and Microstructure of Binary In-Sn Alloys for Flexible Low Temperature Electronic Joints

Effect on Shear Strength and Hardness Properties of Tin Based Solder Alloy, Sn-50Bi, Sn-50Bi+2%TiO<sub>2</sub> Nanoparticles

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