Mechanical Properties and Microstructure of Binary In-Sn Alloys for Flexible Low Temperature Electronic Joints

Zhou, Jianli; Tan, Xin; McDonald, Stuart D.; Nogita, Kazuhiro

doi:10.3390/ma15238321

Cited by 6 publications

(1 citation statement)

References 29 publications

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“…Studies have reported that In-Sn solders had been used for SMT applications, step soldering sequences, heat-sensitive devices, etc. [6][7][8].…”

Section: Introductionmentioning

confidence: 99%

Identification and Evolution of Intermetallic Compounds Formed at the Interface between In-48Sn and Cu during Liquid Soldering Reactions

Shang,

Tian,

Liu

2024

Metals

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It is difficult to confirm the existence of intermetallic compounds (IMCs) between SnIn and Cu, as their atomic numbers are very close, making it challenging to differentiate them through experimental tests. In order to determine IMCs and understand their growth mechanism, this study employed phase identification, morphology observation, and growth kinetics analyses on IMCs formed between In-48Sn solder and polycrystalline Cu substrate during liquid soldering. The experiments were conducted within a temperature range of 160~250 °C for up to 90 min. The obtained results indicated that IMCs formed at the interface depended strongly on the soldering temperature. During long-time soldering below 200 °C, one main IMC species, Cu2(In,Sn), was found at the In-48Sn solder/Cu interface, which showed two different morphologies: a coarse-grained layer at the solder side and a fine-grained layer within the Cu component. When the soldering temperature was increased to 200 °C, Cu6(In,Sn)5 was the only intermetallic compound (IMC) that formed at the point where the In-48Sn/Cu eutectic interface existed. At 250 °C, with an increase in the soldering time, there was a formation of Cu9(In,Sn)4 between Cu and Cu6(In,Sn)5. The growth kinetics analyses indicated that the fast grain boundary/molten-channel diffusion of Cu into solder and their reaction with solder controlled the growth of the interfacial IMCs, with the activation energy of 24.56 kJ/mol when the sample was liquid-state-aged above 200 °C.

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“…Studies have reported that In-Sn solders had been used for SMT applications, step soldering sequences, heat-sensitive devices, etc. [6][7][8].…”

Section: Introductionmentioning

confidence: 99%

Identification and Evolution of Intermetallic Compounds Formed at the Interface between In-48Sn and Cu during Liquid Soldering Reactions

Shang,

Tian,

Liu

2024

Metals

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Influence of alloying elements on microstructure, mechanical properties and corrosion behaviour of hypoeutectic Sn-6.5wt%Zn-0.5 wt%X (X = Ag, Al, Cu) lead-free solders

González-Parra,

Novelo-Peralta,

Lara-Rodríguez

et al. 2024

J Mater Sci: Mater Electron

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Lead-free solders are promising candidates for the replacement of Sn–Pb solders due to their environmental friendly, good thermal properties and wettability which render them suitable for this application. In this study, a set of lead-free solders Sn-6.5 wt. and Sn-6.5 wt% Zn-0.5 wt% X (X = Ag, Al, Cu) were studied by metallography, mechanical and electrochemical techniques. The results show that the addition of the alloying elements Ag, Al and Cu modifies the amount of the eutectic phase and promotes the formation of intermetallic compounds (IMCs). The corrosion resistance of the samples also modified, showing that the formation of IMCs can have detrimental effects with higher current densities in saline media, as determined for the Ag and Al alloyed solders. The corrosion resistance is higher for the unalloyed and the Sn-6.5 wt%Zn-0.5 wt% Cu alloy. However, the addition of Cu not only stabilizes the corrosion products thus increasing the protective properties of the alloy, but also modifies the mechanical behaviour of the lead-free solders and so enhancing the UTS values and ductility. Furthermore, the surface morphology is influenced by the alloying elements showing a smooth surface (Sn-Zn, Cu) or a highly corroded appearance with round aggregates (Ag and Al). These new lead-free solders have a lower melting point with higher ductility than the commercial SAC 305. Therefore, these alternatives have high potential in applications in mechanical engineering.

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The Temperature-Dependent Phase Transformation and Microstructural Characterisation in In-Sn Solder Alloys

Zhou

Tan

et al. 2023

JOM

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Indium-based solder alloys are considered candidates for the next generation of low-temperature solder materials, especially for superconducting joints because of the properties of the β-In3Sn phase. The temperature-dependent phase transformation and thermal expansion behaviour of two different solder compositions including In-35Sn (in wt.%) and In-25.6Sn have been characterised using an in situ synchrotron powder X-ray diffraction method. The c-axis of the β-In3Sn unit cell in the In-35Sn alloy exhibited a complex relationship with increasing temperature compared to the positive increasing trend in In-25.6Sn due to the temperature-dependent solubility of Sn in β-In3Sn and change in the volume fraction of phases commencing at 80°C. In situ heating scanning electron microscopy recorded a real-time melting-solidification microstructure variation and phase transition during annealing at 90°C that was further analysed using energy dispersive X-ray spectroscopy. The observations are discussed with respect to the lattice parameters of the γ-InSn4 and β-In3Sn phases and the proportions and composition of both phases present within the alloys.

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Mechanical Properties and Microstructure of Binary In-Sn Alloys for Flexible Low Temperature Electronic Joints

Cited by 6 publications

References 29 publications

Identification and Evolution of Intermetallic Compounds Formed at the Interface between In-48Sn and Cu during Liquid Soldering Reactions

Identification and Evolution of Intermetallic Compounds Formed at the Interface between In-48Sn and Cu during Liquid Soldering Reactions

Influence of alloying elements on microstructure, mechanical properties and corrosion behaviour of hypoeutectic Sn-6.5wt%Zn-0.5 wt%X (X = Ag, Al, Cu) lead-free solders

The Temperature-Dependent Phase Transformation and Microstructural Characterisation in In-Sn Solder Alloys

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