Development of microbolometer with high fill factor and high mechanical stability by shared-anchor structure

Kim, Tae Hyun; Kyung, Kimyung; Park, Jae Hong; Kim, Young Su; Lim, Sung Kyu; Kim, Kyungmin; Lee, Kwyro; Welham, Chris; Kim, Hee Yeoun

doi:10.1117/12.918916

Cited by 8 publications

(2 citation statements)

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“…Design2 has four anchors around unit pixel and one anchor is shared by four neighboring pixels. The mechanical simulation results and fabrication processes for design1 and design2 have been described elsewhere [12]. As shown in Fig.…”

Section: Methodsmentioning

confidence: 99%

“…The CCD triggering signal was supplied by analog output signal from the data acquisition (DAQ) board (NI PCIe-6353, National Instruments). Each pixel on the microbolometer array was electrically controlled by a SaFPA™ (Semi-Active Focal Plane Array) measurement circuit [12]. The system control and image-processing program was written in the LABVIEW programming environment.…”

Section: Introductionmentioning

confidence: 99%

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Thermal Characterization of Individual Pixels in Microbolometer Image Sensors by Thermoreflectance Microscopy

Ryu¹,

Choi²,

Kim³

et al. 2015

JSTS:Journal of Semiconductor Technology and Science

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Abstract-Thermal characterization of individual pixels in microbolometer infrared image sensors is needed for optimal design and improved performance. In this work, we used thermoreflectance microscopy on uncooled microbolometer image sensors to investigate the thermal characteristics of individual pixels. Two types of microbolometer image sensors with a shared-anchor structure were fabricated and thermally characterized at various biases and vacuum levels by measuring the temperature distribution on the surface of the microbolometers. The results show that thermoreflectance microscopy can be a useful thermal characterization tool for microbolometer image sensors.

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Section: Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%