In order to shield perovskite solar cells (PSCs) from extrinsic degradation factors and ensure long-term stability, effective encapsulation technology is indispensable. Here, a facile process is developed to create a glass−glass encapsulated semitransparent PSC using thermocompression bonding. From quantifying the interfacial adhesion energy and considering the power conversion efficiency of devices, it is confirmed that bonding between perovskite layers formed on a hole transport layer (HTL)/indiumdoped tin oxide (ITO) glass and an electron transport layer (ETL)/ITO glass can offer an excellent lamination method. The PSCs fabricated through this process have only buried interfaces between the perovskite layer and both charge transport layers as the perovskite surface is transformed into bulk. The thermocompression process leads the perovskite to have larger grains and smoother, denser interfaces, thereby not only reducing defect and trap density but also suppressing ion migration and phase segregation under illumination. In addition, the laminated perovskite demonstrates enhanced stability against water. The self-encapsulated semitransparent PSCs with a wide-band-gap perovskite (E g ∼ 1.67 eV) demonstrate a power conversion efficiency of 17.24% and maintain long-term stability with PCE > ∼90% in the 85 °C shelf test for over 3000 h and with PCE > ∼95% under AM 1.5 G, 1-sun illumination in an ambient atmosphere for over 600 h.
The fabrication and evaluation of a wide-range vacuum gauge for monitoring the pressure level inside an infrared focal plane array and a waferlevel packaging (WLP) are reported. The proposed vacuum gauge has a microbolometer structure produced using the conventional surface micromachining process to achieve thermal isolation and high sensitivity. This structure has other advantages such as fast response time, a wider measurement range and easier integration to a Si substrate compared with other pressure sensors. The evaluation results show that the fabricated vacuum gauge has a linear dynamic range and a sensitivity of 10 −3 to 10 5 K/W/torr for vacuum pressures ranging from 10 −6 to 760 torr. Also, the response time to vacuum change is reduced from 0.11 s at 10 −5 torr to 15 ms at 100 torr. Therefore, the microbolometer-based vacuum gauge has good potential for application in WLP, and it is possible to hermetically seal it with various read-out integrated circuit substrates.
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