Development and Characterization of Thermal Enhancement Structures for Single-Phase Liquid Cooling in Microelectronics Systems

Zhang, H. Y.; Pinjala, D.; Joshi, Y.K.; Wong, Teck Neng; Toh, K.C.

doi:10.1080/01457630701483620

Cited by 15 publications

(5 citation statements)

References 13 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Except the application of silicide as a barrier layer in contact with the common side of silicon and metal, Silicide was firstly used in LSI 6 as a poly-side (the electrode gate of poly silicon/silicide). The poly-side line MoSi 2 was one of the first applications of poly-side in DRAM 7 in early 1980.…”

Section: Transition From Tisi 2 To Nisimentioning

confidence: 99%

“…In this regard, MOS field effect transistors or MOSFET 2 is the main and basic component of most of the electronic systems nowadays. Among the numerous parameters of these systems, MOSFET gate length, which is a critical criterion of integrated circuits, will decrease to about 10 nm in 2016 [1][2][3][4][5][6]. The predicted process of decrement of the gate length by ITRS, has been shown in the Figs.…”

Section: Introductionmentioning

confidence: 95%

See 1 more Smart Citation

Size Effect in Physical and Other Properties of Nanostructured Coatings

Mahmood

2011

Nanocoatings

View full text Add to dashboard Cite

Section: Transition From Tisi 2 To Nisimentioning

confidence: 99%

Section: Introductionmentioning

confidence: 95%

Size Effect in Physical and Other Properties of Nanostructured Coatings

Mahmood

2011

Nanocoatings

View full text Add to dashboard Cite

“…Such high heat fluxes cannot be addressed by using conventional cooling solutions such as vapor chamber [7]- [8], and single-phase liquid cooling [9]- [12]. Vapor chamber in combination with forced convection could dissipate heat flux no more than 100 W/cm 2 [13], while single-phase liquid cooling could reach 350 W/cm 2 [14]- [16].…”

Section: Introductionmentioning

confidence: 99%

Microchannel Thermal Management System With Two-Phase Flow for Power Electronics Over 500 W/cm² Heat Dissipation

Hou

Zhang

Huang

et al. 2020

IEEE Trans. Power Electron.

View full text Add to dashboard Cite

In this paper, a microchannel thermal management system (MTMS) with the two-phase flow using the refrigerant R1234yf with low global warming potential is presented. The thermal test vehicles (TTVs) were made of either single or multiple thermal test chips embedded in the substrates, which were then attached to the MTMS. The system included two identical aluminum microchannel heat sinks (MHSs) connected in series in the cooling loop, which also consisted of a gas flowmeter, a miniature compressor, a condenser, a throttling device, and accessory measurement components. The experimental results showed that the thermal management system could dissipate a heat flux of 526 W/cm 2 while maintaining the junction temperature below 120 ºC. For SiC MOSFET with a higher junction temperature, e.g., 175 ºC , the current system is expected to dissipate a heat flux as high as about 750 W/cm 2. The effects of the rotational speed of the compressor, the opening of the throttling device, TTV layout on MHS, and a downstream heater on the cooling performance of the system were analyzed in detail. The study shows that the present thermal management with a twophase flow system is promising cooling technology for the high heat flux SiC devices.

show abstract

“…There are two kinds of liquid cooling system, namely single-phase liquid cooling [18][19][20][21] and two-phase liquid cooling. [22][23][24][25] Two-phase liquid cooling is based on heat removal by the evaporation of a coolant in microchannels.…”

Section: Introductionmentioning

confidence: 99%

Experimental assessment of on-chip liquid cooling through microchannels with de-ionized water and diluted ethylene glycol

Won

Kim

2016

Jpn. J. Appl. Phys.

View full text Add to dashboard Cite

Recent progress in Si IC devices, which results in an increase in power density and decrease in device size, poses various thermal challenges owing to high heat dissipation. Therefore, conventional cooling techniques become ineffective and produce a thermal bottleneck. In this study, an on-chip liquid cooling module with microchannels and through Si via (TSV) was fabricated, and cooling characteristics were evaluated by IR measurements. Both the microchannels and TSVs were fabricated in a Si wafer by deep reactive ion etching (DRIE) and the wafer was bonded with a glass wafer by a anodic bonding. The fabricated liquid cooling sample was evaluated using two different coolants (de-ionized water and 70 wt % diluted ethylene glycol), and the effect of coolants on cooling characteristics was investigated.

show abstract

Development and Characterization of Thermal Enhancement Structures for Single-Phase Liquid Cooling in Microelectronics Systems

Cited by 15 publications

References 13 publications

Size Effect in Physical and Other Properties of Nanostructured Coatings

Size Effect in Physical and Other Properties of Nanostructured Coatings

Microchannel Thermal Management System With Two-Phase Flow for Power Electronics Over 500 W/cm² Heat Dissipation

Experimental assessment of on-chip liquid cooling through microchannels with de-ionized water and diluted ethylene glycol

Contact Info

Product

Resources

About

Development and Characterization of Thermal Enhancement Structures for Single-Phase Liquid Cooling in Microelectronics Systems

Cited by 15 publications

References 13 publications

Size Effect in Physical and Other Properties of Nanostructured Coatings

Size Effect in Physical and Other Properties of Nanostructured Coatings

Microchannel Thermal Management System With Two-Phase Flow for Power Electronics Over 500 W/cm2 Heat Dissipation

Experimental assessment of on-chip liquid cooling through microchannels with de-ionized water and diluted ethylene glycol

Contact Info

Product

Resources

About

Microchannel Thermal Management System With Two-Phase Flow for Power Electronics Over 500 W/cm² Heat Dissipation