Microchannel Thermal Management System With Two-Phase Flow for Power Electronics Over 500 W/cm² Heat Dissipation

Abstract

In this paper, a microchannel thermal management system (MTMS) with the two-phase flow using the refrigerant R1234yf with low global warming potential is presented. The thermal test vehicles (TTVs) were made of either single or multiple thermal test chips embedded in the substrates, which were then attached to the MTMS. The system included two identical aluminum microchannel heat sinks (MHSs) connected in series in the cooling loop, which also consisted of a gas flowmeter, a miniature compressor, a condenser, a throttling device, and accessory measurement components. The experimental results showed that the thermal management system could dissipate a heat flux of 526 W/cm 2 while maintaining the junction temperature below 120 ºC. For SiC MOSFET with a higher junction temperature, e.g., 175 ºC , the current system is expected to dissipate a heat flux as high as about 750 W/cm 2. The effects of the rotational speed of the compressor, the opening of the throttling device, TTV layout on MHS, and a downstream heater on the cooling performance of the system were analyzed in detail. The study shows that the present thermal management with a twophase flow system is promising cooling technology for the high heat flux SiC devices.

Thermal Management Technologies Used for High Heat Flux Automobiles and Aircraft: A Review

“…An environment-friendly refrigerant with low boiling points, R1234yf, was selected as a working fluid. The experimental results showed that the TMS could dissipate a heat flux of 526 W/cm 2 while maintaining the junction temperature below 120 • C. Moreover, for SiC-based power electronics with a higher junction temperature, this system was expected to dissipate a heat flux up to 750 W/cm 2 [86]. Recently, T'Jollyn et al [90] experimentally investigated the heat transfer performance of the baseplate via pool boiling.…”

Investigation on Thermal Resistance and Capacitance Characteristics of a Highly Integrated Power Control Unit Module

“…However, the temperature gradient of pin-fin structures is higher than that of microchannels. A microchannel design provides a larger contact surface area and achieves better cooling for power modules [19][20][21]. In addition, a two-phase cooling scheme [22][23][24][25] can also be used to enhanced heat dissipation in power modules.…”