Design of metal interconnects for stretchable electronic circuits

González, Mario; Axisa, Fabrice; Bulcke, Mathieu Vanden; Brosteaux, Dominique; Vandevelde, Bart; Vanfleteren, Jan

doi:10.1016/j.microrel.2008.03.025

Cited by 368 publications

(349 citation statements)

References 12 publications

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“…This failure has been addressed by Li et al [1] and Gonzalez et al [4]. Here, it is conclusively shown that a serpentine shape of the metal conductor permits large deformation of the substrate while at the same time small strains are present in the metal.…”

Section: Introductionmentioning

confidence: 75%

“…[1,2,3,4] and the recently published review paper by Rogers et al [5] and references therein. In order to provide conformability to the body and a high comfort during wearing, mechanical stretchability is a prerequisite for these electronics applications.…”

Section: Introductionmentioning

confidence: 99%

“…Recently, horseshoe and zigzag interconnect patterns have been proposed as metal conductor designs [4,6] involving in-plane patterned copper conductors onto poly(dimethylsiloxane) (PDMS) rubber flat substrates. The horseshoe shape offers high stretchability (strains up to 100% have been achieved without metal failure [7]) combined with a rather low I/O density.…”

Section: Introductionmentioning

confidence: 99%

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Stretching-induced interconnect delamination in stretchable electronic circuits

Sluis¹,

Hsu²,

Timmermans³

et al. 2010

J. Phys. D: Appl. Phys.

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Abstract. Stretchable electronics offer increased design freedom of electronic products. Typically, small rigid semiconductor islands are interconnected with thin metal conductor lines on top of, or encapsulated in, a highly compliant substrate, such as a rubber material. A key requirement is large stretchability, i.e. the ability to withstand large deformations during usage without any loss of functionality. Stretching induced delamination is one of the major failure modes that determines the amount of stretchability that can be achieved for a given interconnect design. During peel testing, performed to characterize the interface behaviour, the rubber is severely lifted at the delamination front while at the same time fibrillation of the rubber at the peel front is observed by ESEM analyses. The interface properties are established by combining the results of numerical simulations and peeling experiments at two distinct scales: the global force-displacement curves and local rubber lift geometries. The thus quantified parameters are used to predict the delamination behaviour of zigzag and horseshoe patterned interconnect structures. The accuracy of these finite element simulations is assessed by a comparison of the calculated evolution of the shape of the interconnect structures and the fibrillation areas during stretching with experimental results obtained by detailed in-situ analyses.

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Section: Introductionmentioning

confidence: 75%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Stretching-induced interconnect delamination in stretchable electronic circuits

Sluis¹,

Hsu²,

Timmermans³

et al. 2010

J. Phys. D: Appl. Phys.

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show abstract

“…A popular approach has been to use hybrid structures with traditional stiff electronics components, interconnected by flexible free-standing metal tracks using specific designs, such as horse shoe-or serpentine-shaped metal ribbons, to minimise tensile strains in the metal. 1,2 These solutions result in performant and resilient stretchable devices, but are unsuitable for a range of applications such as; 1/ when body fluid components such as biological cells can interfere with the small free-standing metal tracks or 2/ for photovoltaic or bio-sensing applications where charge collection must be 2D and over a large area.…”

Section: Introductionmentioning

confidence: 99%

Stretchable conducting gold films prepared with composite MWNT/PDMS substrates

et al. 2015

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Novel stretchable conducting films were prepared by depositing gold layers onto polymer nano-composites substrates formed by in-situ crosslinking of polydimethylsiloxane (PDMS) in the presence of multiwall carbon nanotubes (MWNT). The MWNT content interferes with the PDMS cure reaction giving variations in thermal degradation, solvent swelling, mechanical and electrical properties. Tensile cycling experiments were carried out on the gold-coated PDMS and nano-composite substrates SEM analysis and electrical measurements demonstrated that the crack widening and increased electrical resistance observed during strain cycling were reversible. The inclusion of 8 % MWNT into PDMS brought more micro-cracking in the gold layer yet reduced the electrical resistance of the gold-coated samples by 172X at 5 % strain, 38X at 10 % strain and 19X at 20 %. Hence, this improvement in conduction is attributed to assisted-conduction through the MWNT loaded substrate. This mechanism results in a more stable and reproducible electrical behaviour, making electrical conduction less critically dependent on defects in the gold layer.

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“…(1) meander-shaped gold conductors (15 lm thick) akin to a two-dimensional spring, 8 (2) wavy gold conductors that are deposited on prestretched PDMS, 9,10 and (3) straight microcracked gold conductors (20 nm to 100 nm thick). 11 Microcracked gold conductors have several advantages, a major one being that microcracked films can be stretched isotropically, whereas both meander-shaped and wavy gold conductors can only be stretched anisotropically.…”

Section: Introduction Stretchable Electronics Need Elastically Stretcmentioning

confidence: 99%

Elastically Stretchable Insulation and Bilevel Metallization and Its Application in a Stretchable RLC Circuit

Harris

Graudejus

Wagner

2011

Journal of Elec Materi

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Stretchable electronics need stretchable wiring membranes that are equivalent to printed wiring boards but with elastically stretchable insulators and multilevel metallization. We have developed technology for elastically stretchable two-level metallization on an elastomeric membrane. Two levels of conductors were separated by a photopatternable elastomeric dielectric and connected through via holes. They were evaluated at uniaxial tensile strains of up to 30% and then used to create an elastomeric resistor-inductor-capacitor (RLC) circuit, whose alternating-current (AC) response was measured at biaxial tensile strains of up to 6%. We describe the fabrication process, morphology, and electrical performance of the bilevel metallization and the RLC circuit.

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Design of metal interconnects for stretchable electronic circuits

Cited by 368 publications

References 12 publications

Stretching-induced interconnect delamination in stretchable electronic circuits

Stretching-induced interconnect delamination in stretchable electronic circuits

Stretchable conducting gold films prepared with composite MWNT/PDMS substrates

Elastically Stretchable Insulation and Bilevel Metallization and Its Application in a Stretchable RLC Circuit

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