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Abstract. Stretchable electronics offer increased design freedom of electronic products. Typically, small rigid semiconductor islands are interconnected with thin metal conductor lines on top of, or encapsulated in, a highly compliant substrate, such as a rubber material. A key requirement is large stretchability, i.e. the ability to withstand large deformations during usage without any loss of functionality. Stretching induced delamination is one of the major failure modes that determines the amount of stretchability that can be achieved for a given interconnect design. During peel testing, performed to characterize the interface behaviour, the rubber is severely lifted at the delamination front while at the same time fibrillation of the rubber at the peel front is observed by ESEM analyses. The interface properties are established by combining the results of numerical simulations and peeling experiments at two distinct scales: the global force-displacement curves and local rubber lift geometries. The thus quantified parameters are used to predict the delamination behaviour of zigzag and horseshoe patterned interconnect structures. The accuracy of these finite element simulations is assessed by a comparison of the calculated evolution of the shape of the interconnect structures and the fibrillation areas during stretching with experimental results obtained by detailed in-situ analyses.

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Summary Full‐field identification methods are increasingly used to adequately identify constitutive parameters to describe the mechanical behavior of materials. This paper investigates the more recently introduced one‐step method of integrated digital image correlation (IDIC) with respect to the most commonly used two‐step method of finite element model updating (FEMU), which uses a subset‐based DIC algorithm. To make the comparison as objective as possible, both methods are implemented in the most equivalent manner and use the same FE model. Various virtual test cases are studied to assess the performance of both methods when subjected to different error sources: (1) systematic errors, (2) poor initial guesses for the constitutive parameters, (3) image noise, (4) constitutive model errors, and (5) experimental errors. Results show that, despite the mathematical similarity of both methods, IDIC produces less erroneous and more reliable results than FEMU, particularly for more challenging test cases exhibiting small displacements, complex kinematics, misalignment of the specimen, and image noise. Copyright © 2015 John Wiley & Sons, Ltd.

One of the major issues during soft lithographic processes is that, if the pressing force on the stamp becomes too high, the stamp may erroneously come into contact with the substrate in zones where contact is not intended. This decreases the patterning accuracy and may lead to badly or nonperforming electronic devices and is therefore undesired. Design rules, available at an early stage in the design phase, are desired to speed-up the development of this technique. Ultimately, these rules should give an indication of the critical pressure that can safely be applied on the stamp thereby avoiding unwanted contact between the stamp and the substrate. To obtain these critical pressures, numerical analyses of the deformation behavior of two characteristic configurations in the microstructured surface pattern of the rubber stamp are performed. The deformation behavior of the rubber is modeled according to a Gaussian and a non-Gaussian approach, leading to a neo-Hookean and Arruda-Boyce constitutive model, respectively. Besides these material nonlinearities, geometrical nonlinearities are taken into account as well. The calculated pressure at which undesired contact takes place (the roof collapse pressure) is compared to experimentally obtained values for two particular types of structures, and the results are in agreement within the error margins of the experiments and those ensuing from the assumptions of the numerical simulations.

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