Design and characterization of wirebonds for use in high shock environments

Marinis, Thomas F.; Soucy, Joseph W.

doi:10.1109/ectc.2009.5074197

Cited by 4 publications

(4 citation statements)

References 2 publications

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“…As process nodes shrink, bondpad pitches reduce, causing the mutual inductance between wires to become an increasingly large contributor to the total wire inductance. Under acceleration, bondwires exhibit mechanical deflection that is especially prominent at the apex of the parabolic curve [12]. Changing a bondwire's geometry or material will result in a change in the magnitude of the wire's deflection for a given acceleration.…”

Section: A Fully Integrated Cmos Accelerometermentioning

confidence: 99%

“…Despite the fact that Au and Al have a similar Young's modulus, Au is 7.14 times denser than Al, resulting in a much greater bondwire displacement for the same applied 1530-437X/$26.00 © 2010 IEEE acceleration. The peak displacement per acceleration of gravity (g) at the apex of a semicircular bondwire is derived as [12] (1)…”

Section: A Fully Integrated Cmos Accelerometermentioning

confidence: 99%

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A Fully Integrated CMOS Accelerometer Using Bondwire Inertial Sensing

2011

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This paper presents the design, implementation, and characterization of a fully integrated accelerometer using a bondwire inertial sensor. The accelerometer was implemented in a standard CMOS process without microelectromechanical processing. The system consists of a gold and aluminum bondwire inertial sensor and readout circuitry. Finite-element analysis was used to characterize the mechanical performance of the accelerometer and reinforce empirical data. The system includes a fully differential frequency modulation downconversion architecture and consumes 13.5 mW while achieving a gain of 10 kHz/g, a bandwidth of 700 Hz, and a resolution of 80 mg. The chip was fabricated in an 0.13-m CMOS process with an area of 1.1 mm 2 .

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Section: A Fully Integrated Cmos Accelerometermentioning

confidence: 99%

Section: A Fully Integrated Cmos Accelerometermentioning

confidence: 99%

A Fully Integrated CMOS Accelerometer Using Bondwire Inertial Sensing

2011

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“…Bondwires exhibit self-inductance and mutualinductance to neighboring wires; they also exhibit mechanical deflections while experiencing a force [14]. The displacement of a parabolic bondwire due to acceleration can be expressed as [12] (1)…”

Section: A Mechanical Model Of Bondwire Inertial Sensorsmentioning

confidence: 99%

A Fully-Integrated Wireless Bondwire Accelerometer With Closed-loop Readout Architecture

Liao

Huang

Cheng

et al. 2015

IEEE Trans. Circuits Syst. I

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This paper presents a fully-integrated wireless bondwire accelerometer using a closed-loop readout interface that effectively reduces the noise from electrical circuits and long-term frequency drifts. The proposed accelerometer was fabricated using 0.18-CMOS technology without micro electromechanical systems (MEMS) processing. To reduce manufacturing errors, the bondwire inertial sensors are wire-bonded on the chip pads, thereby enabling a precisely-defined length and space between sensing bondwires. The proposed wireless accelerometer using a pair of 15.2 and 25.4 bondwires achieves a linear transducer gain of 33 mV/g, bandwidth of 5 kHz, a noise floor of 700 , and 4.5 bias stability. The acceleration data is digitalized by an energy-efficient 10-bit SAR ADC and then wirelessly transmitted in real time to the external reader by a low-power on-off shift keying (OOK) transmitter. The proposed architecture consumes 9 mW and the chip area is 2 mm 2.4 mm.

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“…Under acceleration, bondwires exhibit mechanical detection that is especially prominent at the apex of the parabolic curve. The peak displacement per acceleration of gravity (g) at the apex of a semicircular bondwire is derived as [4] …”

Section: Bondwire Modelmentioning

confidence: 99%

A CMOS wireless two-axis digital accelerometer using bondwire inertial sensing

Liao

Shi

Otis

2011

2011 16th International Solid-State Sensors, Actuators and Microsystems Conference

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This paper presents a two-axis wireless accelerometer using bondwire inertial sensing without MEMS processing. The bondwire sensors are bonded chip-to-chip to reduce the manufacturing uncertainty. The accelerometer consists of oscillator-based inductance-to-frequency converters, a digital frequency demodulator, and a 400 MHz FSK wireless transmitter. A digitally programmable interface allows the digitalization of acceleration information and control of bandwidth and resolution of the sensor system. The accelerometer has a transducer gain of 7.5 kHz/g and a bandwidth of 1.2 kHz while consuming 63 mW.

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Design and characterization of wirebonds for use in high shock environments

Cited by 4 publications

References 2 publications

A Fully Integrated CMOS Accelerometer Using Bondwire Inertial Sensing

A Fully Integrated CMOS Accelerometer Using Bondwire Inertial Sensing

A Fully-Integrated Wireless Bondwire Accelerometer With Closed-loop Readout Architecture

A CMOS wireless two-axis digital accelerometer using bondwire inertial sensing

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