A Fully Integrated CMOS Accelerometer Using Bondwire Inertial Sensing

Liao, Yu-Te; Biederman, William; Otis, Brian

doi:10.1109/jsen.2010.2052031

Cited by 20 publications

(18 citation statements)

References 17 publications

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“…Even if these wires were held down (e.g., via epoxy), there are still aluminum wire-bonds connecting the resonator to the oscillator circuit. Given that wirebonds have acceleration sensitivities high enough to be used even as acceleration sensors in previous work [20], wirebonds could very well limit the acceleration sensitivity resolution of the test apparatus.…”

Section: Discussionmentioning

confidence: 99%

Acceleration sensitivity of small-gap capacitive micromechanical resonator oscillators

Kim

Akgul

Yang

et al. 2010

2010 IEEE International Frequency Control Symposium

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Abstract-The vector components of acceleration sensitivity Γ for a closed-loop oscillator referenced to a wine-glass disk arraycomposite resonator employing tiny (~92nm) electrode-toresonator capacitive transducer gaps were measured along axes perpendicular and parallel to the substrate to be Γ vertical~1 3.6ppb/g and Γ lateral~4 .92ppb/g, respectively, which are on par with commercial quartz-based oscillator products. Interestingly, the measured acceleration sensitivity greatly exceeds the prediction of theory. In particular, models for frequency shifts due to variations in electrical stiffness and mechanical stress predict acceleration sensitivities orders of magnitude lower than measured here. Consideration of other microphonic contributors reveals that the measurements of this work were probably limited by the bond wires and package stresses of the boardlevel realization of the oscillator, so are very likely not representative of the performance actually achievable by a fullyintegrated micromechanical resonator oscillator, where MEMS and transistors share a single chip. Still, the measured microphonic performance on par with mid-grade quartz oscillators at least provides some reassurance that the tiny electrode-toresonator gaps used in high frequency capacitively transduced micromechanical resonators will not compromise the stabilities of oscillators referenced to them in conventional applications that currently accept mid-grade quartz resonators.

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Section: Discussionmentioning

confidence: 99%

Acceleration sensitivity of small-gap capacitive micromechanical resonator oscillators

Kim

Akgul

Yang

et al. 2010

2010 IEEE International Frequency Control Symposium

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“…Oscillators are widely used for reactance sensing through measuring the shift in the oscillation frequency [32]- [36]. As shown in Fig.…”

Section: A Conventional Oscillator-based Sensormentioning

confidence: 99%

Oscillator-Based Reactance Sensors With Injection Locking for High-Throughput Flow Cytometry Using Microwave Dielectric Spectroscopy

Chien

Niknejad

2016

IEEE J. Solid-State Circuits

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This paper presents the analysis and design of oscillator-based reactance sensors employing injection locking for high-throughput label-free single-cell analysis using dielectric spectroscopy at microwave frequencies. By injection-locking two sensing LC-oscillators with an I/Q excitation source, the measurement of the sample-induced frequency shift caused by the interaction with the electromagnetic fields is performed through phase detection with injection-strength-dependent transducer gain. Such inherent phase amplification offered by the injection locking not only relaxes the design requirement for the readout circuits but also maintains the highest rejection against common-mode errors associated with the drift of the supply voltage and the environmental parameters. To reduce flicker noise contribution, a chopping technique employing phase modulation is exploited. In addition, this paper presents a novel ping-pong chopping approach to alleviate chopping-induced dc offset. In this prototype, four sensing channels, covering frequencies between 6.5 and 30 GHz, are distributed along a microfluidic channel fabricated with standard photolithography. Measurements show that the proposed microwave capacitive sensors achieve a sub−aFrms of noise sensitivity at 100 kHz filtering bandwidth, enabling measurement throughput exceeding 1 k cells/s. The sensor prototype is implemented in 65 nm CMOS technology and consumes 65 mW at 1 V supply.

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“…In another work, stacked ball bumps were used to build up entire metal pillars and walls as shown in figure 10 a [123] and ball bumps were used to contact pads that are situated on the sidewall of a chip by placing the ball bumps in an angle, as shown in figure 10 b [3]. Another interesting application of wire bonding is the use of parallel bond wires as movable masses in an accelerometer for very-low-cost sensor applications, as shown in figure 11 [125,127,128]. Therefore, parallel bond wires are connected to the sensor read-out electronic circuit.…”

Section: A) B)mentioning

confidence: 99%

Unconventional applications of wire bonding create opportunities for microsystem integration

Fischer

Korvink

Roxhed

et al. 2013

J. Micromech. Microeng.

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, G. et al. (2013) "Unconventional applications of wire bonding create opportunities for microsystem integration" Journal of Micromechanics and Microengineering, 23(8) Abstract. Automatic wire bonding is a highly mature, cost-efficient and broadly available back-end process, intended to create electrical interconnections in semiconductor chip packaging. Modern production wire bonding tools can bond wires with speeds of up to 30 bonds per second with placement accuracies of better than 2 µm, and the ability to form each wire individually into a desired shape. These features render wire bonding a versatile tool also for integrating wires in applications other than electrical interconnections. Wire bonding has been adapted and used to implement a variety of innovative microstructures. This paper reviews unconventional uses and applications of wire bonding that have been reported in the literature. The used wire bonding techniques and materials are discussed, and the implemented applications are presented. They include the realization and integration of coils, transformers, inductors, antennas, electrodes, through silicon vias (TSVs), plugs, liquid and vacuum seals, plastic fibers, shape memory alloy (SMA) actuators, energy harvesters, and sensors.

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A Fully Integrated CMOS Accelerometer Using Bondwire Inertial Sensing

Cited by 20 publications

References 17 publications

Acceleration sensitivity of small-gap capacitive micromechanical resonator oscillators

Acceleration sensitivity of small-gap capacitive micromechanical resonator oscillators

Oscillator-Based Reactance Sensors With Injection Locking for High-Throughput Flow Cytometry Using Microwave Dielectric Spectroscopy

Unconventional applications of wire bonding create opportunities for microsystem integration

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