Deposition of Parylene C and characterization of its hermeticity for the encapsulation of MEMS and medical devices

Selbmann, Franz; Baum, Mario; Wiemer, Maik; Geßner, Thomas

doi:10.1109/nems.2016.7758283

Cited by 16 publications

(21 citation statements)

References 3 publications

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“…First, PPx-C, -D, and -AF4 films with thicknesses of 100 nm on Si exhibited surface roughnesses of 2.150, 2.366, and 2.690 nm, respectively. This implies that our flow-based CVD system can produce a quality of thin films with tailored thickness comparable (or even superior) to that of previous literature reports . Additionally, the surface roughness values on different surfaces (e.g., Al and IGZO) are almost identical with those on the Si surface.…”

Section: Results and Discussionsupporting

confidence: 79%

“…This implies that our flow-based CVD system can produce a quality of thin films with tailored thickness comparable (or even superior) to that of previous literature reports. 46 Additionally, the surface roughness values on different surfaces (e.g., Al and IGZO) are almost identical with those on the Si surface. In addition, PPx films do not exhibit thickness dependence, as shown in Figure S1.…”

Section: Resultsmentioning

confidence: 68%

“…The thickness deposited per milligram of dimer is about 2.2 nm/mg for PPx-C. On the other hand, the yield in previous literature was ca. 1 nm/mg or less for PPx-C. − …”

Section: Results and Discussionmentioning

confidence: 99%

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Chemically Tunable Organic Dielectric Layer on an Oxide TFT: Poly(p-xylylene) Derivatives

Kim

Jang

Bae

et al. 2021

ACS Appl. Mater. Interfaces

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Inorganic materials such as SiO x and SiN x are commonly used as dielectric layers in thin-film transistors (TFTs), but recent advancements in TFT devices, such as inclusion in flexible electronics, require the development of novel types of dielectric layers. In this study, CVD-deposited poly(p-xylylene) (PPx)-based polymers were evaluated as alternative dielectric layers. CVD-deposited PPx can produce thin, conformal, and pinhole-free polymer layers on various surfaces, including oxides and metals, without interfacial defects. Three types of commercial polymers were successfully deposited on various substrates and exhibited stable dielectric properties under frequency and voltage sweeps. Additionally, TFTs with PPx as a dielectric material and an oxide semiconductor exhibited excellent device performance; a mobility as high as 22.72 cm2/(V s), which is the highest value among organic gate dielectric TFTs, to the best of our knowledge. Because of the low-temperature deposition process and its unprecedented mechanical flexibility, TFTs with CVD-deposited PPx were successfully fabricated on a flexible plastic substrate, exhibiting excellent durability over 10000 bending cycles. Finally, a custom-synthesized functionalized PPx was introduced into top-gated TFTs, demonstrating the possibility for expanding this concept to a wide range of chemistries with tunable gate dielectric layers.

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Section: Results and Discussionsupporting

confidence: 79%

Section: Resultsmentioning

confidence: 68%

See 1 more Smart Citation

Chemically Tunable Organic Dielectric Layer on an Oxide TFT: Poly(p-xylylene) Derivatives

Kim

Jang

Bae

et al. 2021

ACS Appl. Mater. Interfaces

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show abstract

“…The deposition process allows pinhole-free growth without inducing internal stress and possesses a high step coverage [ 2 ]. Due to the unique properties of the film, parylene is considered the material of choice for various domains, such as bio-MEMS [ 3 , 4 , 5 , 6 , 7 ], electronic insulation [ 8 , 9 ], energy harvesting [ 10 , 11 , 12 ], flow and temperature sensors [ 13 , 14 , 15 ] or medical device encapsulation [ 2 , 16 , 17 , 18 ]. Furthermore, a parylene film demonstrating excellent thermal stability is highly desirable for high-temperature environment applications, such as aerospace, automotive, battery, or high-power electronic fields.…”

Section: Introductionmentioning

confidence: 99%

Thermal Analysis of Parylene Thin Films for Barrier Layer Applications

et al. 2022

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Biocompatible polymer films demonstrating excellent thermal stability are highly desirable for high-temperature (>250 °C) applications, especially in the bioelectronic encapsulation domain. Parylene, as an organic thin film, is a well-established polymer material exhibiting excellent barrier properties and is often the material of choice for biomedical applications. This work investigated the thermal impact on the bulk properties of four types of parylene films: parylene N, C, VT4, and AF4. The films, deposited using the standard Gorham process, were analyzed at varying annealing temperatures from room temperature up to 450 °C. Thermal properties were identified by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) methods, while X-ray diffraction (XRD) analysis showed the effect of high-temperature exposure on the structural properties. In addition to thermal and structural analysis, the barrier properties were measured through the helium transmission rate (HTR) and the water vapor transmission rate (WVTR). Fluorinated parylene films were confirmed to be exceptional materials for high-temperature applications. Parylene AF4 film, 25um thick, demonstrated excellent barrier performance after 300 °C exposure, with an HTR and a WVTR of 12.18 × 103 cm3 (STP) m−2 day−1 atm−1 and 6.6 g m−2 day−1, respectively.

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“…Another approach is maximising the cooling by adapting the double-side cooling principle [2][3][4][5]. However, this requires a coating, which is able to enter the smallest crevices, like Parylene does, which is also used for medical instruments and implants [6][7][8][9]. Figure 1 shows a simplified structure of such a double-side cooled module.…”

Section: Introductionmentioning

confidence: 99%

Parylene as Coating for Power Semiconductor Devices

Clausner¹,

Hanf²,

Meier³

et al. 2021

ISPS'21 Proceedings

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The introduction of wide band gap semiconductor devices leads to smaller package sizes, higher power densities and higher switching frequencies, which is advantageous compared to the power electronics based on the conventional silicon devices. However, due to the small insulation distances and the limited temperature range of available package materials, it is not possible to exploit these advantages completely. In this study, the properties of Parylene coatings as passivation layers in power semiconductor devices is investigated. The material would be particularly advantageous for double-side cooled power modules because it can fill the small gaps between different conductive layers, which is not possible with conventional packaging technologies. Parylene is promising to provide an excellent insulation performance even in these areas and exhibits a good temperature stability. Furthermore, this polymer acts as a barrier for humidity, dirt and corrosive gasses. Two types of Parylene were tested using the High-Voltage, High Humidity, High Temperature Reverse Bias (HV-H³TRB) test on substrate level and the better Parylene type also on automotive three-phase modules. The results are encouraging, although the performance strongly depends on the Parylene type and although a sensitivity to the respecive surface condition to be coated became apparent.

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Deposition of Parylene C and characterization of its hermeticity for the encapsulation of MEMS and medical devices

Cited by 16 publications

References 3 publications

Chemically Tunable Organic Dielectric Layer on an Oxide TFT: Poly(p-xylylene) Derivatives

Chemically Tunable Organic Dielectric Layer on an Oxide TFT: Poly(p-xylylene) Derivatives

Thermal Analysis of Parylene Thin Films for Barrier Layer Applications

Parylene as Coating for Power Semiconductor Devices

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