Thermal Analysis of Parylene Thin Films for Barrier Layer Applications

Buchwalder, Sébastien; Borzì, Aurelio; León, Juan J. Díaz; Bourgeois, Florian; Nicolier, Cléo; Nicolay, Sylvain; Neels, Antonia; Zywitzki, O.; Hogg, Andreas; Burger, Jürgen

doi:10.3390/polym14173677

Cited by 9 publications

(4 citation statements)

References 46 publications

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“…We also measured the THz-TDS on the samples encapsulated in Parylene N and report on three times higher charge-carrier mobility compared to the samples transferred onto Parylene N (before the encapsulation). The encapsulation contributes to the long-term stability and protection of devices from humidity and contamination [71] and protection against mechanical damage, leading to a significantly higher carrier mobility than that reported for other scalable graphene encapsulation strategies, including atomic layer deposition [58].…”

Section: Resultsmentioning

confidence: 96%

High mobility graphene field effect transistors on flexible EVA/PET foils

Khan,

Ji,

Zhou

et al. 2024

2D Mater.

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Monolayer graphene is a promising material for a wide range of applications, including sensors, optoelectronics, antennas, EMR shielding, flexible electronics, and conducting electrodes. Chemical vapor deposition (CVD) of carbon atoms on a metal catalyst is the most scalable and cost-efficient method for synthesizing high-quality, large-area monolayer graphene. The usual method of transferring the CVD graphene from the catalyst to a target substrate involves a polymer carrier which is dissolved after the transfer process is completed. Due to often unavoidable damage to graphene, as well as contamination and residues, carrier mobilities are typically 1 000 − 3 000 cm^2/(V s), unless complex and elaborate measures are taken. Here, we report on a simple scalable fabrication method for flexible graphene field-effect transistors that eliminates the polymer interim carrier, by laminating the graphene directly onto office lamination foils, removing the catalyst, and depositing Parylene N as a gate dielectric and encapsulation layer. The fabricated transistors show field and Hall-effect mobilities of 7 000 − 10 000 cm^2/(V s) with a residual charge-carrier density of 2 × 10^11 1/cm^2 at room temperature. We further validate the material quality by terahertz time domain spectroscopy (THz-TDS) and observation of the quantum Hall effect at low temperatures in a moderate magnetic field of ∼ 5 T. The Parylene encapsulation provides long-term stability and protection against additional lithography steps, enabling vertical device integration in multilayer electronics on a flexible platform.

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Section: Resultsmentioning

confidence: 96%

High mobility graphene field effect transistors on flexible EVA/PET foils

Khan,

Ji,

Zhou

et al. 2024

2D Mater.

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“…Here, a short description of materials is given since the details can be found in [17]. Polished and untreated Si and SiO 2 wafers were used as substrates and the vapor deposition polymerization (VDP) technique was applied for depositing the AF4 parylene, with 1.6 and 2.5 µm thicknesses onto the substrates.…”

Section: Samples and Pull-off Testsmentioning

confidence: 99%

“…There are a lot of research papers to be found on parylene C, which is also the most used parylene type in the electronics industry [9][10][11][12][13][14][15][16]. On the other hand, a much lower number of papers are to be found on the parylene type AF4 (aliphatic fluorinate-4), which, especially in comparison to the other parylene types, stands out due to its high thermal stability (up to 550 • C) [17]. In addition, it also offers very good dielectric properties, chemical inertness, high resistance against oxidation, low moisture intake and high UV stability [18,19].…”

Section: Introductionmentioning

confidence: 99%

Assessment of AF4 Parylene Cohesion/Adhesion on Si and SiO2 Substrates by Means of Pull-Off Energy

2023

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Advanced packaging solutions require insulation and passivation materials with exceptional properties which can also fulfill the reliability needs of electronics devices such as MEMS, sensors or power modules. Since bonding (cohesive/adhesive) properties of packaging coatings are very important for reliable functioning of electronics devices, the bonding of aliphatic fluorinate-4 (AF4) parylene coatings was assessed in this work. As there is a lack of data regarding its bonding towards different substrates, pull-off tests of 1.6 and 2.5 µm thick AF4 coatings on silicon (Si) and glass (SiO2) substrates were performed. These showed a clear difference in the pull-off F/s curves between the AF4 coatings on Si and SiO2 substrates. This difference is parameterized by the pull-off energy, which will be presented in this work. To further understand the origin of the distinction in the pull-off energies between the AF4-Si and AF4-SiO2 samples and subsequently the cohesive/adhesive properties, mechanical and structural characterization was conducted on the AF4 coatings, where a clear difference in the E-modulus and crystallinity was observed. The Si and SiO2 wafers were shown to facilitate the CVD growth of the AF4 film distinctively, which likely relates to the divergent thermal properties of the substrates. Understanding of the cohesive/adhesive properties of AF4 coatings on different substrate materials advances the usage of the AF4 in electronics packaging technologies.

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“…Parylene is formed from granular powdered material called dimer (di-paraxylylene). Dimer is converted under heat and a vacuum to a gaseous polymerizing monomer suitable for deposition on substrates at room temperature [27][28][29][30]. The poly-para-xylylene-based polymer can be used with metals and plastics as a coating for electrical components and assemblies.…”

Section: Parylenementioning

confidence: 99%

Evaluation of Insulation against Contact Heat, Radiant Heat and Sensory Comfort of Basalt Fabric-Based Composites with Parylene C Coating

Tokarska,

Miśkiewicz,

Puszkarz

et al. 2023

Fibres &Amp; Textiles in Eastern Europe

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The article concerns research on using Parylene C coating on basalt fabric-based composites with potential use in protective clothing to improve their insulation against contact heat and radiant heat, as well as the sensory comfort of the user. The outcomes of the contact heat method showed that applying Parylene C coating improved the thermal insulation of all tested composites. Two of them achieved the first efficiency level of protection. The results of the radiant heat method presented that using the Parylene C coating did not cause changes in the thermal insulation against heat radiation of all tested materials; the radiant heat transfer index reached values in the range of 12.4 - 12.9 s. X-ray tomography (micro-CT) allowed for identifying breaks/snaps in basalt fibers irritating the user’s skin in direct contact with the composite. Micro-CT results also showed that using Parylene C coating eliminated the effect of skin irritation and increased the usability of basalt fabrics in clothing.

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Thermal Analysis of Parylene Thin Films for Barrier Layer Applications

Cited by 9 publications

References 46 publications

High mobility graphene field effect transistors on flexible EVA/PET foils

High mobility graphene field effect transistors on flexible EVA/PET foils

Assessment of AF4 Parylene Cohesion/Adhesion on Si and SiO2 Substrates by Means of Pull-Off Energy

Evaluation of Insulation against Contact Heat, Radiant Heat and Sensory Comfort of Basalt Fabric-Based Composites with Parylene C Coating

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