Abstract:Advanced packaging solutions require insulation and passivation materials with exceptional properties which can also fulfill the reliability needs of electronics devices such as MEMS, sensors or power modules. Since bonding (cohesive/adhesive) properties of packaging coatings are very important for reliable functioning of electronics devices, the bonding of aliphatic fluorinate-4 (AF4) parylene coatings was assessed in this work. As there is a lack of data regarding its bonding towards different substrates, pu… Show more
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