IntroductionSilicon is of great interest for the integration of photonic devices because of Si VLSI CMOS technology and its transparency at the telecom wavelengths, 1.3 µm and 1.5 µm. A major hurdle for silicon has traditionally been its light emission inefficiency due to its indirect bandgap. Efforts to overcome this hurdle have come in the form of a Raman Laser [1,2] and LEDs [3,4] that utilize material engineering to increase the light emission efficiency of silicon. Another approach has been the heterogeneous integration of Si with III-V semiconductors including heteroepitaxial growth [5] and wafer bonding. Prior work in wafer bonding has been carried out by bonding III-V lasers onto a silicon substrate confining the optical mode in the III-V region [6]. The work demonstrated here is done by defining the optical mode in the silicon and leaving the III-V quantum well region homogeneous across the wafer. With this approach, most of the optical mode is confined in the silicon waveguide providing high coupling efficiency with other passive silicon-based photonic devices while still achieving high optical gain through evanescent coupling into the III-V region. We report here the first demonstration of a silicon evanescently coupled laser (SEL). It operates at 1538 nm with an optically pumped threshold of 30 mW and a maximum power output of 1.4 mW at 12 ˚C.