1982
DOI: 10.1088/0034-4885/45/10/003
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Defects in silicon

Abstract: The method of obtaining pure polycrystalline silicon is described, followed by short accounts of how this material is converted into single-crystal form either by the Czochralski (cz) pulling method or the float-zone (FZ) method. It is shown that the silicon contains various impurities including oxygen, carbon, boron and possibly hydrogen. If a silicon nitride crucible is used instead of silica for the growth of cz crystals they contain nitrogen. Crystals also contain structural defects derived from the aggreg… Show more

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Cited by 137 publications
(70 citation statements)
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“…The saturation of dangling bonds by hydrogen is also observed by infrared absorption in proton-implanted GaAs and GaP corresponding to Ga-H modes at As and P vacancies (Newman and Woodhead, 1980). The absorption in GaAs anneals out in the temperature region 200-250 °C.…”
Section: B Lattice-ion Vacancies and Hydrogen In Semiconductorsmentioning
confidence: 76%
“…The saturation of dangling bonds by hydrogen is also observed by infrared absorption in proton-implanted GaAs and GaP corresponding to Ga-H modes at As and P vacancies (Newman and Woodhead, 1980). The absorption in GaAs anneals out in the temperature region 200-250 °C.…”
Section: B Lattice-ion Vacancies and Hydrogen In Semiconductorsmentioning
confidence: 76%
“…However oxygen induced type of defects are formed or annealed at much higher temperature [17,18,8,19,20]. On the other hand, more recombination centre can be introduced when oxide precipitates are decorated by transitions metals as recently found for Fe in p-type by Murphy et al [24] then the formation kinetics should also change.…”
Section: Discussionmentioning
confidence: 99%
“…Indeed, the lifetime of n-type wafers is generally much higher than p-type wafers for the absence of boron-oxygen (B-O) complex responsible for light induced degradation [3,4] and for the smaller recombination strength of metal impurities like Fe [5,6]. Although implementation of Dash's process has removed the most severe effects of dislocations [7], Cz crystals are still not defect-free [8]. While p-type ingots are dominated by B-O complexes and impurities, the general higher lifetime in n-type cause other defects, like intrinsic defects, dislocations, etc., to become relevants.…”
Section: Introductionmentioning
confidence: 99%
“…However, the required germanium doping in the order of 1 × 10 20 cm −3 to prevent LID is probably not desirable for industrial-scale production due to the increased ingot growth costs and tendency to induce the nucleation of multi-crystalline silicon growth [65,66]. For carbon co-doping, carbon is believed to compete with boron for the formation of complexes with oxygen [67]. There are also uncertainties as to the impact carbon has in reducing the lifetime of silicon.…”
Section: Additional Non-boron Related Doping During Crystal Growthmentioning
confidence: 99%