2008
DOI: 10.1063/1.2924410
|View full text |Cite
|
Sign up to set email alerts
|

Defect reduction of GaAs/Si epitaxy by aspect ratio trapping

Abstract: We report on the metallorganic chemical vapor deposition growth of GaAs on patterned Si (001) substrates, which utilizes the aspect ratio trapping method. It was found that when growing GaAs above the SiO2 trenched region, coalescence-induced threading dislocations and stacking faults originated on top of the GaAs/SiO2 interfaces. These defects were found to be indirectly related to the initial defect-trapping process during trenched GaAs growth. Causes of coalescence defect formation and its reduction were ex… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1

Citation Types

2
46
0

Year Published

2009
2009
2019
2019

Publication Types

Select...
7
2
1

Relationship

0
10

Authors

Journals

citations
Cited by 66 publications
(48 citation statements)
references
References 12 publications
2
46
0
Order By: Relevance
“…The resultant III-V on Si templates can be treated as virtual substrates (or compliant substrates) for subsequent epi-structure growth and device fabrication. Initial investigations of continuous GaAs ilms on SiO 2 -patterned Si substrates [136] discovered coalescence defects appearing in the form of threading dislocations, twin defects and stacking faults above the SiO 2 ( Fig. 20(a) and (b)).…”
Section: U N C O R R E C T E D P R O O F Q Li Km Lau Progress In mentioning
confidence: 99%
“…The resultant III-V on Si templates can be treated as virtual substrates (or compliant substrates) for subsequent epi-structure growth and device fabrication. Initial investigations of continuous GaAs ilms on SiO 2 -patterned Si substrates [136] discovered coalescence defects appearing in the form of threading dislocations, twin defects and stacking faults above the SiO 2 ( Fig. 20(a) and (b)).…”
Section: U N C O R R E C T E D P R O O F Q Li Km Lau Progress In mentioning
confidence: 99%
“…In this paper we discuss a III/V laser integration approach on (001) Si, which is based on aspect ratio trapping (ART) [21] [22] in narrow oxide trenches starting with a V-shaped Si surface. A high aspect ratio allows for an efficient defect trapping whereas III/V nucleation on the {111} facets of the V-shape avoids the formation of anti-phase domains [23] [24].…”
mentioning
confidence: 99%
“…The first challenge is the lattice mismatch between silicon and gallium arsenide (4.1%), which induces the formation of crystalline defects to accommodate the strain in the material. To reduce crystalline defects density, various smart improvements have been investigated like post-growth thermal cycle annealing, 2,8 insertion of dislocation filter layer, 9 selective growth in trenches using aspect ratio trapping (ART) method [10][11][12] or Ge/GeSi buffer layer. 13 The second challenge is the difference of thermal expansion coefficients between Si and III-V (6.6 × 10 −6 K −1 and 2.3 × 10 −6 K −1 for GaAs and Si, respectively), which limits the film thickness before crack appears.…”
mentioning
confidence: 99%