2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual.
DOI: 10.1109/relphy.2003.1197799
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Data retention, endurance and acceleration factors of NROM devices

Abstract: Reliability shldies of Saifun NROM' devices are presented. Data retention characteristics vs time, temperature and cycling level are explained based on a charge happing and re-emission model. The thermal acceleration factor between ambient storage and 150°C is shown to he 7~1 0~. Storage life at room temperature ailer IOOK memory cycles is predicted to he in excess of 100 years. Qualification method of NROM devices is discussed in view of these results. [

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Cited by 36 publications
(24 citation statements)
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“…The threshold-voltage shift can be due to the lateral motion of charge and electron-hole recombination inside the nitride [6] or due to the vertical loss through the bottom oxide [7], [8]. Recently, a new model was proposed, explaining the threshold-voltage loss by the annealing of the interface traps during retention [9].…”
Section: Endurance and Retentionmentioning
confidence: 99%
“…The threshold-voltage shift can be due to the lateral motion of charge and electron-hole recombination inside the nitride [6] or due to the vertical loss through the bottom oxide [7], [8]. Recently, a new model was proposed, explaining the threshold-voltage loss by the annealing of the interface traps during retention [9].…”
Section: Endurance and Retentionmentioning
confidence: 99%
“…Thus we see that from the one hand the simulation results obtained by our program Memory confirm the relation ∆Q ~ Q and from the other hand the Device simulation program Medici allows confirmation of the relation Q ~ V t , and hence ∆Q ~ ∆V t . These relations are used as a basis to derive the equation for the fast V t shift in conditions of cycling [8,12] …”
Section: Kinetic Features Of Spreading Of Injected Carriers In Onomentioning
confidence: 99%
“…Stability of the threshold voltage, V t of a programmed state at high temperatures (retention quality of the memory device) is characterized by V t shift at high temperatures (HT V t shift) [6][7][8][9].…”
mentioning
confidence: 99%