Post cycling data retention reliability model of NROM devices is presented. The degradation rate of the threshold voltage of cycled cells is shown to be a multiplication of three functions: 1) bit density; 2) endurance; and 3) storage time and temperature. The functions are fitted to experimental results of products of three technology nodes. The retention loss is interpreted in terms of thermally activated lateral migration of trapped holes in the ONO layer. The holes' migration quenches the electrons' field over the channel of the device, degrading its threshold voltage. The migration process is presented as a dispersive transport process. Saturation of the retention loss is demonstrated at threshold voltage levels well above the neutral state of the device. From the retention loss function we derive a time-to-failure formula and an expression for the thermal acceleration factor of NROM products useful for determining stress conditions for accelerated reliability tests.

Reliability shldies of Saifun NROM' devices are presented. Data retention characteristics vs time, temperature and cycling level are explained based on a charge happing and re-emission model. The thermal acceleration factor between ambient storage and 150°C is shown to he 7~1 0~. Storage life at room temperature ailer IOOK memory cycles is predicted to he in excess of 100 years. Qualification method of NROM devices is discussed in view of these results. [

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The realization of a 4-bit NROM cell is possible due to the two physically separated bits on each side of the cell. Only 4 Vt levels on each bit are required. Key features of a 4-bit product are optimized technology, accurate and fast programming algorithm (3MB/s write speed), no single bit failures and window sensing with moving reference as an error detection and correction scheme.