Cyanate Ester-Based Encapsulation Material for High-Temperature Applications

Chidambaram, Vivek; Rong, Eric Phua Jian; Gan, Chee Lip; Daniel, Rhee Min Woo

doi:10.1007/s11664-013-2665-1

Cited by 13 publications

(8 citation statements)

References 5 publications

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“…The polymerization structures of the ternary composite obtained by simultaneous EP and BMI modification in curing reaction process were more complex than the other resin materials, leading to the qualitative changes in polymer aggregation. The self-polymerization reaction occurs in the CE monomer matrix after being heated to curing temperature to form the regularly reticulated configurations of densely distributed triazine-rings, which are capable of restricting the molecular segments to a stable state below a specific high temperature [ 31 ], whereas EP or BMI reinforcement will abate the regularity of CE reticulated configurations and thus reduce the intermolecular forces, resulting in a decreased kinetic energy needed for molecular chains to escape from van der Waals interactions at a lower T g . Nevertheless, in the extended curing process of the CE/BMI/EP composite, the copolymerizations of EP and BMI with CE monomers can produce various heterocyclic derivatives of pyrimidine, which will substantially intensify intermolecular entanglements.…”

Section: Resultsmentioning

confidence: 99%

Ameliorated Mechanical and Dielectric Properties of Heat-Resistant Radome Cyanate Composites

Liu

Gao

et al. 2020

Molecules

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In order to improve the mechanical and dielectric properties of radome cyanate, a synergistic reinforcement method is employed to develop a resin-based ternary-composite with high heat-resistance and preferable radar-band transmission, which is expected to be applied to fabricate radomes capable of resisting high temperature and strong electric field. According to copolymerization characteristics and self-curing mechanism, epoxy resin (EP) and bismaleimide (BMI) are employed as reinforcements mixed into a cyanate ester (CE) matrix to prepare CE/BMI/EP composites of a heat-resistant radome material by high-temperature viscous-flow blending methods under the catalysis of aluminum acetylpyruvate. The crystallization temperature, transition heat, and reaction rate of cured polymers were tested to analyze heat-resistance characteristics and evaluate material synthesis processes. Scanning electron microscopy was used to characterize the micro-morphology of tensile fracture, which was combined with the tensile strength test and dynamic thermomechanical analysis to investigate the composite modifications on tenacity and rigidity. Weibull statistics were performed to analyze the experimental results of the dielectric breakdown field, and the dielectric-polarization and wave-transmission performances were investigated according to alternative current dielectric spectra. Compared with the pure CE and the CE composites individually reinforced by EP or BMI, the CE/BMI/EP composite acquires the most significant amelioration in both the mechanical and electrical insulation performances as indicated by the breaking elongation and dielectric breakdown strength being simultaneously improved by 40%, which are consistently manifested by the obviously increased transverse lines uniformly distributed on the fracture cross-section. Furthermore, the glass-transition temperature of CE/BMI/EP composite reaches the highest values of nearly 300 °C, with the relative dielectric constant and dielectric loss being mostly reduced to less than 3.2 and 0.01, respectively. The experimental results demonstrate that the CE/BMI/EP composite is a highly-qualified wave-transmission material with preferences in mechanical, thermostability, and electrical insulation performances, suggesting its prospective applications in low-frequency transmittance radomes.

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Section: Resultsmentioning

confidence: 99%

Ameliorated Mechanical and Dielectric Properties of Heat-Resistant Radome Cyanate Composites

Liu

Gao

et al. 2020

Molecules

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“…TGA is used to measure weight gain or loss of the material as a function of time, temperature, and environmental factors. Most of the changes in the properties can be traced back to the loss of weight [28]. In this section, first of all, high temperature stabilities of BT laminate and cured prepreg are compared at a ramp rate of 10 °C/min.…”

Section: A High Temperature Stability Of the Pcb Embedded Materialsmentioning

confidence: 99%

“…Then, both dynamic and isothermal TGA are performed to further investigate the high temperature stability of the BT laminate. Dynamic TGA is used to determine the degradation temperature, while isothermal TGA is used to determine the decomposition temperature [28].…”

Section: A High Temperature Stability Of the Pcb Embedded Materialsmentioning

confidence: 99%

Characterization of PCB Embedded Package Materials for SiC MOSFETs

Hou

Wang

Lin

et al. 2019

IEEE Trans. Compon., Packag. Manufact. Technol.

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In this paper, a novel fan-out panel-level PCB embedded package technology for SiC MOSFET power module is presented to address parasitic inductances, heat dissipation, and reliability issues that are inherent with aluminum wires used in conventional packaging scheme. To withstand high temperature beyond 175 °C and high voltage over 1.2 kV and improve thermo-mechanical reliability of the fan-out panel-level PCB embedded SiC power module, BT laminate and prepreg with high temperature stability, high dielectric strength, CTE matching with SiC, and high Tg are selected as PCB embedded package materials. Then, high temperature stabilities, dielectric breakdown strength, and thermo-mechanical performances of the embedded materials are characterized. The experimental results show that the PCB embedded materials can withstand high temperature beyond 200 °C and high voltage above 1.2 kV. Tg is as high as over 260 °C and CTE is matching with SiC. Besides, in order to provide one guideline for the high-temperature and high-pressure laminating process during the PCB embedded SiC MOSFETs packaging, cure kinetics of BT prepreg are analyzed. The results show that one-hour curing time at 280 °C curing temperature and two-hour curing time at 210 °C curing temperature can ensure the full cure of the BT prepreg.

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“…Cyanate ester based resin, and the silicone based resin with different filler materials were chosen for evaluation since both are high-temperature resins [4]. Common filler materials studied in this work are silica, alumina and quartz.…”

Section: Introductionmentioning

confidence: 99%