1999
DOI: 10.1116/1.591053
|View full text |Cite
|
Sign up to set email alerts
|

Correlation of atomic force microscopy sidewall roughness measurements with scanning electron microscopy line-edge roughness measurements on chemically amplified resists exposed by x-ray lithography

Abstract: Articles you may be interested inAn atomic force microscopy-based method for line edge roughness measurement

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
5

Citation Types

1
12
0

Year Published

2002
2002
2015
2015

Publication Types

Select...
7
1
1

Relationship

0
9

Authors

Journals

citations
Cited by 31 publications
(13 citation statements)
references
References 18 publications
1
12
0
Order By: Relevance
“…M. Fouchier et al proposed a technique by tilting the sample for sidewalls imaging [26,27]. This approach is suitable for sidewall scan with a complex calibration routine [28]. Recently, a three-dimensional (3D) AFM has been developed to scan undercut sidewalls with nanometer precision [29].…”
Section: Introductionmentioning
confidence: 99%
“…M. Fouchier et al proposed a technique by tilting the sample for sidewalls imaging [26,27]. This approach is suitable for sidewall scan with a complex calibration routine [28]. Recently, a three-dimensional (3D) AFM has been developed to scan undercut sidewalls with nanometer precision [29].…”
Section: Introductionmentioning
confidence: 99%
“…4,[7][8][9][10][11] In this method, a sample featuring a network of lines is cleaved along the lines. The sidewall of the line closest to the cleaved edge is then imaged using an AFM.…”
Section: Introductionmentioning
confidence: 99%
“…There have been several studies on LER and SWR measurements with scanning electron microscopy (SEM) and atomic force microscopy (AFM) techniques. 17 LERs of negative and positive tone electron beam resists, and LERs of etched SiN / SiO 2 /Si waveguides were measured utilizing top-down SEM micrographs and the obtained LERs were utilized to optimize the fabrication process. 7-10 Image processing techniques and Fourier analysis techniques have been examined to improve the fidelity of LER measurements from SEM pictures.…”
Section: Introductionmentioning
confidence: 99%