2016 6th Electronic System-Integration Technology Conference (ESTC) 2016
DOI: 10.1109/estc.2016.7764733
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Copper wire in automotive: Key challenges and robust validation

Fabien Quercia
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Alberto Mancaleoni
2
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Cited by 3 publications
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References 13 publications
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Copper wire degradation under high temperature and high humidity without molding compound

Lim
1
,
Goroll
2
,
Loh
3
et al. 2021
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5
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1
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Copper wire degradation under high temperature and high humidity without molding compound

Lim
1
,
Goroll
2
,
Loh
3
et al. 2021
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
5
0
1
0
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Delamination-induced stitch crack of copper wires

Soestbergen
1
,
Mavinkurve
2
,
Shantaram3
et al. 2017
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
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Mold Compound and Copper Wire Selection for Quad-Flat Packages with High Density Leadframe in Automotive Applications

Tan1,
Au2,
Low3
et al. 2018
2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT)
3
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