Delamination-induced stitch crack of copper wires

Soestbergen, M. van; Mavinkurve, A.; Shantaram, Sandeep; Zaal, J.J.M.

doi:10.1109/eurosime.2017.7926294

Cited by 8 publications

(1 citation statement)

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“…A small strip feature appeared at a depth of 0.4 mm inside the ASIC package (calculated from the time of the reflected wave, the velocity of the sound in this composite material is taken as 2800 m/s) [9]. This mode of feautre inside the ASICs can be explained by the stitch crack caused by delamination [10], To extract more information about the low correlation region, the pure waveforms from this region is compared before and after the liquid nitrogen treatment, we have observed a phase inversion in the waveform at a particular depth inside the chip, this is shown in Figure 8. The waveforms are compared after and before treating with the liquid nitrogen at the low correlation regions, the clear phase inversion in the waveform, which is typically considered as an defect in the SAM (corresponding to the blue region in Figure 7).…”

Section: Figure 5 Images Of the Correlation Analysis Applied To 3 Dif...mentioning

confidence: 99%

Reliability studies of electronic components for the operation at cryogenic temperature

Poonthottathil,

Krennrich,

Eisch

et al. 2019

Preprint

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Cold electronics is a key technology in many areas of science and technology including space exploration programs and particle physics. A major experiment with a very large number of analog and digital electronics signal processing channels to be operated at cryogenic temperatures is the next-generation neutrino experiment, the Deep Underground Neutrino Experiment (DUNE). The DUNE detector uses liquid Argon at 87K as a target material for neutrinos, and as a medium to track charged particles resulting from interactions in the detector volume. The DUNE electronics [1] consists of custom-designed ASIC (Application Specific Integrated Circuits) chips based on low power 180 nm-CMOS technology. The main risk for this technology is that the electronics components will be immersed in liquid argon for many years (20-30 years) without access. Reliability issues of ASICs may arise from thermal stress, packaging, and manufacturing-related defects: if undetected those could lead to long-term reliability and performance problems. The scope of this paper is to explore non-destructive evaluation techniques for their potential use in a comprehensive quality control process during prototyping, testing and commissioning of the DUNE cold electronics system. Specifically, we have used the Scanning Acoustic Microscopy and X-ray tomography to study permanent structural changes in the ASIC chips associated with thermal cycling between the room and cryogenic temperatures.

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Section: Figure 5 Images Of the Correlation Analysis Applied To 3 Dif...mentioning

confidence: 99%