Mold Compound and Copper Wire Selection for Quad-Flat Packages with High Density Leadframe in Automotive Applications

Tan, Vanessa Wyn Jean; Au, Yin Kheng; Low, Boon Yew; Eu, Poh Leng; Tan, L.C.

doi:10.1109/iemt.2018.8511776

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Mold Compound and Copper Wire Selection for Quad-Flat Packages with High Density Leadframe in Automotive Applications

Cited by 3 publications

References 3 publications

Microstructural characterization of alloyed palladium coated copper wire under high temperature

Microstructural characterization of alloyed palladium coated copper wire under high temperature

Wire Sweep Improvement Study in Large-Scale Molded Quad-Flat-No-Lead Packaging

Sulfur Ingression on Encapsulated Leadframe of Discrete Semiconductor Package

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