Copper wire degradation under high temperature and high humidity without molding compound

Lim, Myo–Taeg; Goroll, Michael; Loh, Hai Guan; Chen, Zhong; Tan, Chuan Seng

doi:10.1109/eptc53413.2021.9663891

Cited by 5 publications

(2 citation statements)

References 13 publications

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“…Cu wire began to emerge in the mid-1990s and was not initially deployed in large scale manufacturing due to its vulnerability to wire corrosion and oxidation (Xu et al, 2009). Currently, many researchers are dedicated to studying the reliability issues of copper wires (Lim et al, 2021;Mathew et al, 2022;Qin et al, 2019). As a solution to the drawbacks of Cu wire bonding, different types of Cu alloys have been introduced since 2010, some examples being Pd-doped or Pd-coated Cu wires for various applications and humidity reliability performance (Clauberg et al, 2010.).…”

Section: Introductionmentioning

confidence: 99%

Ultrasonic Bonding of Ag Ribbon on Si Wafers With Various Backside Metallization

Chiang,

Lee,

Lin

et al. 2023

International Journal of Manufacturing, Materials, and Mechanical Engineering

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Ultrasonic ribbon bonding has gained much attention due to the endeavor of achieving higher module performance in power electronic packaging. Among all the ribbon materials, Ag ribbon is a promising candidate due to its superior electrical properties. However, research which has reported the bonding of the ribbon on chip side is scant. Thus, in this study, the authors carried out bonding of the Ag ribbon on various types of metallized wafers to examine the feasibility of Ag ribbon, simulating the bonding scenario on the chip side in power modules. Results revealed that bonding of the Ag ribbon is feasible on those wafers metallized Ag on top. The authors also discussed the implications for the bondability of Ag ribbon with different types of metallization layers.

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Section: Introductionmentioning

confidence: 99%

Ultrasonic Bonding of Ag Ribbon on Si Wafers With Various Backside Metallization

Chiang,

Lee,

Lin

et al. 2023

International Journal of Manufacturing, Materials, and Mechanical Engineering

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“…Over time, a transition layer with a changed chemical composition and lattice parameters is formed at the interface between the base metal and the galvanic deposited film of another metal, through which diffusion of metal atoms occurs due to vacancies. Diffusion in thin films occurs through the interface between the substrate and the coating, diffusion along the grain boundaries of the coating, and diffusion into the more noble metal [28].…”

mentioning

confidence: 99%

Study of the catalytic activity of copper substrates coated with gold and silver foam in alcohol-alkaline media

Tarantseva,

Korostelyova,

Tarantsev

et al. 2023

J. Phys.: Conf. Ser.

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The aim of the study is to find cheap catalysts for the oxidation of ethanol and the release of oxygen in alkaline alcohol fuel cells. The catalytic activity of gold-plated copper substrates coated with silver foam in an ethanol membrane-free fuel cell has been investigated. In this fuel cell, the phase interface between two highly alkaline immiscible liquids acts as a membrane. The highly alkaline medium allows the use of non-platinum catalysts, which, together with the absence of a membrane, can significantly reduce the cost of these fuel cells. It is shown that gold-plated copper substrates coated with silver foam have high activity compared only with gold-plated or only with silver-plated copper catalysts. The currents observed on the proposed catalyst are an order of magnitude higher than the currents on all other electrodes studied. The oxidation of ethanol on it also takes place at more negative potentials. Further stabilization of the silver foam is required due to its tendency to peel off from the substrate in order to successfully use this catalyst in this type of fuel cells.

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A Technology for Bonding Cu Wires with Cu Pads: Structure and Electrical Fatigue Mechanism of Fine Micro-alloyed Cu Wires

Zhao

Chen

Hung

2023

J. Electron. Mater.

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Copper wire degradation under high temperature and high humidity without molding compound

Cited by 5 publications

References 13 publications

Ultrasonic Bonding of Ag Ribbon on Si Wafers With Various Backside Metallization

Ultrasonic Bonding of Ag Ribbon on Si Wafers With Various Backside Metallization

Study of the catalytic activity of copper substrates coated with gold and silver foam in alcohol-alkaline media

A Technology for Bonding Cu Wires with Cu Pads: Structure and Electrical Fatigue Mechanism of Fine Micro-alloyed Cu Wires

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