Composite coating structure in an implantable electronic device

Kokko, Kati; Harjunpää, Hanna; Heino, P.; Kellomäki, Minna

doi:10.1108/09540910910970385

Cited by 4 publications

(1 citation statement)

References 13 publications

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“…On development of implantable electronic devices, bioinert coating is required to protect the devices from body tissues. Such a coating material is required to have properties not only of chemical stability to protect an electric leakage for long term, but also of easy coating operation for the electronic devices [1]. Moreover, the coating material is also required the strong adhesion on the surfaces of electronic devices.…”

Section: Introductionmentioning

confidence: 99%

Organic-Inorganic Hybrids for Bioinert Coating on Implantable Electronic Devices

Kim

Nomura

Kikuta

et al. 2011

KEM

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For the purpose of bioinert coating on electronic devices, we developed the non-hydrolytic sol-gel derived organic-inorganic hybrid materials by addition of epoxy groups which can adhere strongly to the surface of electronic silicon device. The adhesion and chemical properties of hybrids were investigated as a function of epoxy group contents. The hybrids were prepared from 3-metacrloxypropyltrimethoxysilane (MPTS) and 3-glycidoxypropyltrimethoxysilane (GPTS) and diphenylsilanediol. The transparent hybrids were obtained after curing by UV irradiation. The adhesion properties of the hybrids were estimated by the maximum load to resist in a scratch test. The adhesion property of the hybrids increased with addition of GPTS and the highest adhesion was obtained from the hybrid with 5-10 mol% of GPTS. From the element analysis, Si concentrations of all the solutions were less than 2 mM after soaking for 7 d. The Si concentrations were not changed with increasing soaking period. The addition of epoxy groups is effective on improvement of adhesion property of the silica-based hybrid without loosening its chemical stability.

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Section: Introductionmentioning

confidence: 99%

Organic-Inorganic Hybrids for Bioinert Coating on Implantable Electronic Devices

Kim

Nomura

Kikuta

et al. 2011

KEM

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The influence of thermal history on structure and water transport in Parylene C coatings

Davis

Benetatos

Regnault

et al. 2011

Polymer

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Thermal cycling of flip chips on FR‐4 and PI substrates with parylene C coating

Kokko

Frisk

Heino

2010

Soldering &Amp; Surface Mount Technology

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Purpose -The purpose of this paper is to study the effect of conformal coating on the thermal cycling reliability of anisotropically conductive adhesive film (ACF) joined flip chip components on FR-4 and polyimide (PI) substrates. Design/methodology/approach -Test chips were joined using flip chip technology and an anisotropically conductive adhesive. The conformal coating used was parylene C and it was applied using the vapour deposition polymerisation method. The reliability of ACF joined flip chip components on FR-4 and PI substrates was evaluated using 2 40/þ 858C thermal cycling testing. Test lots with and without parylene C coating were studied. Additionally, one test lot with initial moisture inside the coating layer and a PI substrate was subjected to the test. The reliability results were analyzed using Weibull analysis and failure analysis was performed to study the failure mechanisms using cross sectioning and optical and scanning electron microscopy. Findings -The results show a clear difference between the FR-4 and PI substrate materials. PI substrate material proved to be reliable enough to withstand the thermal cycling testing. Two different occurrences of the first failures are seen and analyzed with FR-4 substrates. The conformal coating layer did not seem to impair the reliability. Parylene C coating proved to be a reliable choice to protect, and even improve, the thermal cycling reliability of flip chip devices. Originality/value -Usually, conformal coatings are studied in humidity tests. However, it is also vital to know whether the conformal coatings affect the reliability in thermal cycling and there is a lack of reliability studies in this area. This paper gives reliability data for conformal coating users about the influence of thermal cycling.

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Composite coating structure in an implantable electronic device

Cited by 4 publications

References 13 publications

Organic-Inorganic Hybrids for Bioinert Coating on Implantable Electronic Devices

Organic-Inorganic Hybrids for Bioinert Coating on Implantable Electronic Devices

The influence of thermal history on structure and water transport in Parylene C coatings

Thermal cycling of flip chips on FR‐4 and PI substrates with parylene C coating

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