Competition of K and F sinks during void formation

Гусак, А. М.; Storozhuk, N. V.

doi:10.1134/s0031918x13030071

Cited by 23 publications

(12 citation statements)

References 11 publications

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“…The N eq v and t v denote the vacancy equilibrium molar fraction and relaxation time, respectively. The strength of sinks can be characterized by the mean free path of vacancies L V z D V t V [16]. The vacancy flux is defined as a sum of the diffusion and drift parts:…”

Section: Voids Growth and Its Radiusmentioning

confidence: 99%

The interdiffusion in copper-nickel alloys

Wierzba

Skibiński

2016

Journal of Alloys and Compounds

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Section: Voids Growth and Its Radiusmentioning

confidence: 99%

The interdiffusion in copper-nickel alloys

Wierzba

Skibiński

2016

Journal of Alloys and Compounds

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“…Moreover, the number of voids of bigger sizes increase with the increase in annealing time. Overall number and size of voids will depend on the (i) relaxation of vacancies by sinks (K sinks) [37] (ii) heterogeneous nucleation of new voids because of supersaturation of vacancies and (iii) relaxation of vacancies in existing voids (F sinks) [37]. Relaxation of vacancies by sinks will not create a void.…”

mentioning

confidence: 99%

Bifurcation of the Kirkendall marker plane and the role of Ni and other impurities on the growth of Kirkendall voids in the Cu–Sn system

et al. 2017

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The presence of bifurcation of the Kirkendall marker plane, a very special phenomenon discovered recently, is found in a technologically important Cu-Sn system. It was predicted based on estimated diffusion coefficients; however, could not be detected following the conventional inert marker experiments. As reported in this study, we could detect the locations of these planes based on the microstructural features examined in SEM and TEM. This strengthens the concept of the physico-chemical approach that relates microstructural evolution with the diffusion rates of components and imparts finer understanding of the growth mechanism of phases. The estimated diffusion coefficients at the Kirkendall marker planes indicates that the reason for the growth of the Kirkendall voids is the nonconsumption of excess vacancies which are generated due to unequal diffusion rate of components. Systematic experiments using different purity of Cu in this study indicates the importance of the presence of impurities on the growth of voids, which increases drastically for ≥ 0.1 wt.% impurity. The growth of voids increases drastically for electroplated Cu, commercially pure Cu and Cu(0.5 at.%Ni) indicating the adverse role of both inorganic and organic impurities. Void size and number distribution analysis indicates the nucleation of new voids along with the growth of existing voids with the increase in annealing time. The newly found location of the Kirkendall marker plane in the Cu 3 Sn phase indicates that voids grow on both the sides of this plane which was not considered earlier for developing theoretical models.

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“…Namely, the supersaturation of vacancies can be relaxed in two main ways: (1) the annihilation of vacancies at boundary dislocations (K-sinks), which leads to the creep of the dislocation and corresponding motion of atomic planes, that is to Kirkendall's effect, and (2) the combination of vacancies in the pores (F-sinks) without the motion of planes (Frenkel effect). Mathematical aspects of competition between two types of sinks are described, in particular, in [11,12].…”

Section: Introductionmentioning

confidence: 99%

Influence of Copper Pretreatment on the Phase and Pore Formations in the Solid Phase Reactions of Copper with Tin

Morozovych¹,

Honda²,

Lyashenko³

et al. 2018

Metallofiz. Noveishie Tekhnol.

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The solid-phase reactions of copper with tin are considered, and the porosity of the reaction products depending on the pretreatment of the copper substrate is investigated. Copper substrates for the reaction are prepared by electrodeposition of copper layers with thickness of up to 100 microns on the rolled copper plates. The defects of substrates are determined by the different modes of electrodeposition-stationary, reversible, and stochastic ones. As shown, the thicknesses of the intermediate phases, their ratio, the number and spatial distribution of pores in the reaction products significantly depend on the mode of electrodeposition. The statistical dependences of the pore distribution along and across the interface as well as the characteristics of the roughness of the interface are revealed.Розглядаються твердофазні реакції міді з циною, та досліджується поруватість продуктів реакції в залежності від попереднього оброблення мідного підложжя. Мідні підложжя для реакції готуються шляхом електроосадження прошарків міді товщиною до 100 мкм на прокатані мідні пла-Corresponding author: V. V. Morozovych Îттиски доступнû непосредственно от издателя Ôотокопирование разрешено только в соответствии с лицензиеé  2018 ÈМÔ (Èнститут металлофизики им. Ã. Â. Êурдюмова ÍÀÍ Óкраинû) Íапе÷атано в Óкраине. 1649 1650 V. V. MOROZOVYCH, A. R. HONDA, Yu. O. LYASHENKO et al. тівки. Дефектність підложжя визна÷ається різними режимами електроосадження: стаціонарним, реверсним і стохасти÷ним. Показано, що товщини проміжних фаз, їх відношення, кількість і просторовиé розподіл пор у продуктах реакції істотно залежать від режиму електроосадження. Âиявлено статисти÷ні залежності розподілу пор вздовж і поперек інтерфеéсу, а також характеристики éого шерсткости. Ключові слова: інтерфеéс мідь-цина, дифузія, твердофазні реакції, електроосадження, дефекти, пороутворення, пінінґування. Рассматриваются твёрдофазнûе реакции меди с оловом, и исследуется пористость продуктов реакции в зависимости от предварительноé обработки медноé подложки. Меднûе подложки для реакции готовятся путём электроосаждения слоёв меди толщиноé до 100 мкм на прокатаннûе меднûе пластинки. Дефектность подложек определяется разли÷нûми режимами электроосаждения: стационарнûм, реверсивнûм и стохасти÷еским. Показано, ÷то толщинû промежуто÷нûх фаз, их соотношение, коли÷ество и пространственное распределение пор в продуктах реакции существенно зависят от режима электроосаждения. Óстановленû статисти÷еские зависимости распределения пор вдоль и поперёк интерфеéса, а также характеристики его шероховатости. Ключевые слова: интерфеéс медь-олово, диффузия, твёрдофазнûе реакции, электроосаждение, дефектû, порообразование, пиннинг.

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Competition of K and F sinks during void formation

Cited by 23 publications

References 11 publications

The interdiffusion in copper-nickel alloys

The interdiffusion in copper-nickel alloys

Bifurcation of the Kirkendall marker plane and the role of Ni and other impurities on the growth of Kirkendall voids in the Cu–Sn system

Influence of Copper Pretreatment on the Phase and Pore Formations in the Solid Phase Reactions of Copper with Tin

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