Comparison of low-melting lead-free solders in tensile properties with Sn–Pb eutectic solder

Shohji, Ikuo; Yoshida, Tomohiro; Takahashi, Takehiko; Hioki, Susumu

doi:10.1023/b:jmse.0000012458.57604.db

Cited by 28 publications

(4 citation statements)

References 9 publications

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“…Until recently, most research into solder has dealt with the effects of fatigue and ageing and that which has dealt with the strain rate sensitivity of the material was mainly concerned with quasi-static or creep behaviour [3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19]. However, the increase in the use of mobile telephones and computers means that solder joints are regularly loaded at strain rates higher than those previously considered, in drop impacts for example [20,21].…”

Section: Introductionmentioning

confidence: 99%

Mechanical properties of SnPb and lead-free solders at high rates of strain

Siviour¹,

Walley²,

Proud³

et al. 2005

J. Phys. D: Appl. Phys.

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The mechanical properties of 63% Sn–37% Pb and lead-free solders have been measured at high strain rates (500–3000 s−1) using a split Hopkinson pressure bar. The solders were produced by quenching in water from the melt, to give the phase structure associated with rapid cooling. Measurements were made at −40 °C, room temperature and +60 °C. The Sn–Pb solder was strongly strain rate and temperature dependent, whereas the lead-free solders showed only a weak dependence on these parameters. All of the materials behaved elasto-plastically until a plateau stress of circa 200 MPa. An unexpected, and possibly important, feature of the lead-free solders was the division of the specimens into two groups with different strengths at low temperatures.

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Section: Introductionmentioning

confidence: 99%

Mechanical properties of SnPb and lead-free solders at high rates of strain

Siviour¹,

Walley²,

Proud³

et al. 2005

J. Phys. D: Appl. Phys.

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“…Figure 7 depicts as well the creep behaviour at 120 °C for the commonly used Sn-37Pb solder, which melts at 183 °C [120]. The alloy shows very rapid creep rates in the range of 10 −4 to 10 −2 s −1 for tensile stresses of 10–30 MPa, much higher than low-melting TE such as Bi 2 Te 3 and TAGS-85 deformed at 400 °C.…”

Section: Deformation Mechanismsmentioning

confidence: 99%

Mechanical behaviour of thermoelectric materials – a perspective

Malki

Snyder

Dunand

2023

International Materials Reviews

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Research on thermoelectric materialswith their vast potential for applications in solid-state cooling or energy-conversion deviceshas so far mainly focused on enhancing their conversion efficiency. However, understanding and tailoring the mechanical performance of thermoelectric modules and devices is crucial for their long-term use, as they are subjected to spatially-complex and time-varying thermomechanical stressesboth internal and externalwhich may lead to plastic, fatigue and/or creep deformation. This leads to changes in thermoelectric performance, dimensions (via strain accumulation) and mechanical integrity (via crack and pore formation, leading to failure). This review addresses the current understanding of various modes of stress-induced deformation that can take place during extended operation of thermoelectric materials and their impact on the strain (elastic, plastic, and creep), and the associated damage (bloating, fatigue, and fracture). Finally, some new areas of research straddling mechanical and thermoelectric behaviour are identified.

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“…[2][3][4] However, it was pointed out that the microstructure of the conventional bulk specimen does not correspond with that of the real solder joint, since the real solder joint is miniaturized and it is difficult to duplicate the solidification conditions of the real joint in the bulk specimen. 5,6) Kariya and co-workers developed a new testing method for solder alloys and joints using micro size specimens having analogous size and microstructures to those of real solder joints.…”

Section: Introductionmentioning

confidence: 99%

Effect of Specimen Size and Aging on Tensile Properties of Sn-Ag-Cu Lead-Free Solders

et al. 2008

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Tensile properties of several Sn-Ag-Cu lead-free solders have been investigated by micro size specimens. For as-cast specimens, tensile strength increases with increasing content of Cu and Ag. After aging at 120 C for 168 h, however, tensile strengths are similar among eutectic and hypereutectic alloys. The similar tendency was observed among hypoeutectic alloys. Moreover, negligible change was found in tensile strength between specimens aged at 120 C for 168 h and 504 h in all solders. The strength change with aging corresponds to microstructural change of the solder. In the cases of eutectic and hypoeutectic alloys, as-cast microstructures are composed of coarsened primary Sn phases and finer eutectic phases of Sn and intermetallic compounds. The primary Sn phases and the eutectic phases are homogenized upon aging. In contrast, finer Sn and eutectic phases are formed in as-cast hypereutectic alloys. The finer phases are coarsened upon aging. After aging, homogenization of the Sn phases and the eutectic phases occurred in all solders.

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Comparison of low-melting lead-free solders in tensile properties with Sn–Pb eutectic solder

Cited by 28 publications

References 9 publications

Mechanical properties of SnPb and lead-free solders at high rates of strain

Mechanical properties of SnPb and lead-free solders at high rates of strain

Mechanical behaviour of thermoelectric materials – a perspective

Effect of Specimen Size and Aging on Tensile Properties of Sn-Ag-Cu Lead-Free Solders

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