2015
DOI: 10.1007/s13367-015-0030-z
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Comparison of injection molding and injection/compression molding for the replication of microstructure

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Cited by 15 publications
(7 citation statements)
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“…The surface modification of the fillers could be due to the alleviated phonon scattering at the interface of the VMQ matrix and filler particle compared with that of the unmodified composites. In most cases, the phonon scattering at the interface of the matrix/filler restricts heat transfer and the poor interfacial adhesion between the matrix and the filler leads to large phonon scattering [17]. In this work, we confirmed that HBM can efficiently reduce the thermal conductivity of the composites and provide applications for preparing heat-resistant materials.…”
Section: Thermal Conductivitysupporting
confidence: 68%
“…The surface modification of the fillers could be due to the alleviated phonon scattering at the interface of the VMQ matrix and filler particle compared with that of the unmodified composites. In most cases, the phonon scattering at the interface of the matrix/filler restricts heat transfer and the poor interfacial adhesion between the matrix and the filler leads to large phonon scattering [17]. In this work, we confirmed that HBM can efficiently reduce the thermal conductivity of the composites and provide applications for preparing heat-resistant materials.…”
Section: Thermal Conductivitysupporting
confidence: 68%
“…It could be attributed to the formation of BN‐g‐PA6, which improves the interfacial bonding between PA6 and BN and promotes the dispersion of BN in the matrix of PA6. Then, the strong interfacial bonding could decline the phonon scattering in the area of the interface, and the good dispersion could benefit the formation of the continuous thermal conductive paths or network at a relatively low filler loading.…”
Section: Resultsmentioning
confidence: 99%
“…The surface modification of BNNSs led to a meaningful improvement of the effective thermal conductivity. Generally, the phonon scattering at the interface of matrix/filler restricts heat transfer and a poor interfacial adhesion between the matrix and the fillers leading to a large phonon scattering . The surface functionalization of fillers attributed to an alleviated phonon scattering at the interface of HDPE matrix and SC‐BNNSs particles, compared with that of HDPE/BNNSs nanocomposites .…”
Section: Resultsmentioning
confidence: 99%