The rapid development of 5G equipment and high-power
density electronic
devices calls for high thermal conductivity materials for heat dissipation.
Dielectric polymer composites are highly promising as the electrical
insulation, mechanical property, thermal stability, and even fire
retardance are also of great importance for electrical and electronic
applications. However, the current thermal conductivity enhancement
of dielectric polymer composites is usually at the cost of lowering
the mechanical and electrical insulating properties. In this work,
we report the facile preparation of highly thermally conductive and
electrically insulating poly(p-phenylene benzobisoxazole)
nanofiber (PBONF) composites by incorporating a low weight fraction
of functionalized boron nitride nanosheets (BNNSs). With strong electrostatic
interaction, the BNNSs are encapsulated by PBONFs, and the constructed
robust interconnected network makes the nanocomposites exhibit a nacre-like
structure. Accordingly, the nanocomposite paper has a high in-plane
thermal conductivity of 21.34 W m–1 K–1 at a low loading of 10 wt % BNNSs and exhibits an ultrahigh strength
of 206 MPa. Additionally, the nanocomposite paper exhibits superior
electrical insulation properties up to higher than 350 °C and
excellent fire retardance. The strong heat dissipation capability
of the nanocomposite paper was demonstrated in 5G base stations and
control transformers, showing wide potential applications in high
power density electrical equipment and electronic devices.