In situ Polymerization of Polyamide 6/Boron Nitride Composites to Enhance Thermal Conductivity and Mechanical Properties via Boron Nitride Covalently Grafted Polyamide 6

Abstract

Polyamide 6/boron nitride (PA6/BN) composites were synthesized via anionic ring‐opening polymerization using ε‐caprolactam as the monomer and functional boron nitride (f‐BN) as the thermal conductive filler. Besides the homopolymerized PA6, some PA6 molecule chains would grow from the f‐BN sheets through the “grafting from” strategy. Compared with unfunctional hexagonal BN (h‐BN), the introduction of f‐BN not only improved the dispersion of f‐BN in the matrix but also enhanced the interface bonding between f‐BN and PA6. The homogeneous dispersion of f‐BN in the PA6/f‐BN composite favored the formation of the continuous thermal conductive paths or network at a low f‐BN loading, and the good interface bonding reduced the phonon scattering in the interface, which improved the thermal conductivity (TC) of the PA6/f‐BN composite by 66.0% compared with that of the pure PA6, when only 5 wt% f‐BN was added. In contrast, with the same content of unfunctional h‐BN loading, the TC of the corresponding composite merely improved by 29.7%. Moreover, Young's modulus and yield strength of PA6/f‐BN composites had increased obviously with the introduction of f‐BN, whereas those of PA6/h‐BN composites showed small fluctuation with the same contents of BN. POLYM. ENG. SCI., 60:710–716, 2020. © 2020 Society of Plastics Engineers

Study on the Preparation and Properties of Polyamide/Chitosan Nanocomposite Fabricated by Electrospinning Method

“…The high application of polymeric semiconductors in biological sensors is the most signi cant reasons for the whole research and evolution of these biomaterials. During the past decades, many synthetic approaches have been proposed for the fabrication of one-dimensional semiconductor nanomaterials [15]. Especially, polyamide is one such polymer that has been studied the most owing to its ideal physical and mechanical properties [16].…”

Structure and morphology of thermoplastic polyamide 6 elastomers with different soft segment content and their foaming behavior using supercriticalCO2

“…[ 24 ] Among them, is the heat of fusion of the sample, is the melting enthalpy when the crystallinity of PA6 is 100%, the melting enthalpy of PA6 completely crystallized is 190 J/g. [ 25,26 ]…”

“…Among them, ΔH m is the heat of fusion of the sample, ΔH 0 f is the melting enthalpy when the crystallinity of PA6 is 100%, the melting enthalpy of PA6 completely crystallized is 190 J/g. [25,26] The thermal stability of polyamide elastomers was studied using a thermogravimetric analyzer (Tg209f1), and the samples were heated in nitrogen atmosphere from 25 C to 600 C at a rate of 10 C/min.…”

Synergistic enhancement of thermal conductivity by addition of graphene nanoplatelets to three‐dimensional boron nitride scaffolds for polyamide 6 composites

“…Figure 8(B) presents the thermal conductivities of PA6-matrix composites reported in the literature. [8][9][10]12,13,15,16,30,31,[41][42][43][44] The data illustrate that the through-plane thermal conductivity of the PA6/3D-BN-GNP composite is higher than those of PA6-matrix composites reported in the literature, demonstrating that fabrication of 3D-BN-GNP scaffolds via the ice-templating method and the combined use of hybrid nanofillers is an effective strategy to construct thermallyconductive paths in polymer composites.…”