Co-Packaged Photonics For High Performance Computing: Status, Challenges And Opportunities

Mahajan, Ravi; Li, Xiaoqian; Fryman, Joshua B.; Zhang, Zhichao; Nekkanty, Srikant; Tadayon, Pooya; Jaussi, James; Shumarayev, Sergey; Agrawal, Ankur; Jadhav, S. G.; Singh, Abhishek; Alduino, Andrew; Gujjula, Sushrutha; Chiu, Charles B.; Nordstog, Thomas; Hosseini, Kaveh; Sane, Sandeep; Deshpande, Nitin; Aygün, Kemal; Sarkar, Arnab; Dobriyal, Priyanka; Pothukuchi, S.; Pogue, Vanessa; Hui, David

doi:10.1109/jlt.2021.3104725

Cited by 54 publications

(24 citation statements)

References 29 publications

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“…At these baud rates, the electrical power needed to maintain signal integrity, limits the transmission distance over copper traces. This leads us to the CPO [10,15], where the optical transceivers are small, highly integrated, and assembled close to the host, which in many cases is a high-speed switch, on a common substrate. This is a departure from the traditional pluggable module approach to optical transceivers.…”

Section: Table I Transceiver Module Types and Capabilitiesmentioning

confidence: 99%

“…The optical sources are either heterogeneously attached InP DFB lasers [3] or DFB lasers processed on the silicon platform, from heterogeneously attached InP epitaxial material [4,9]. Although there are multiple approaches to package integration [6,10], the method we have described here uses the silicon photonics device as an interposer, with TSV's.…”

Section: Introductionmentioning

confidence: 99%

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2.5D Heterogeneous Integration for Silicon Photonics Engines in Optical Transceivers

Nagarajan

Liu

Coccioli

et al. 2022

IEEE J. Select. Topics Quantum Electron.

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We present our work in the area of heterogeneous optical integration, where separately manufactured electronic components are assembled on to an active silicon photonics interposer to form a higher-level component. This process allows for the integration of components independently designed and optimized from several different technology and foundry platforms onto a common interposer. Heterogeneous integration is essential for manufacturing higher speed and performance components. Higher levels of integration also allow for closer placement of devices which minimizes the parasitic power consumed to compensate for the frequency dependent losses in the interconnect traces.

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Section: Table I Transceiver Module Types and Capabilitiesmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

2.5D Heterogeneous Integration for Silicon Photonics Engines in Optical Transceivers

Nagarajan

Liu

Coccioli

et al. 2022

IEEE J. Select. Topics Quantum Electron.

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show abstract

“…Intel’s liquid cooling solution is for 540 W of switch IC and 56 W of each CPO. According to the conditions given in the article, they lowered the temperature of the EIC (Electronics IC) by 35°C and the switch die by 8°C [ 1 ]. Cisco’s heat sink and cold plate assembly is a great plan [ 23 ].…”

Section: 5d and 3d Advanced Packaging For Co-packaged Optics (Cpo)mentioning

confidence: 99%

“…1 Introduction 1 The importance of co-packaged optics (CPO). Datacenter traffic keeps growing with the expansion of data-intensive applications, such as AI and high-performance computing (HPC).…”

mentioning

confidence: 99%

Co-packaged optics (CPO): status, challenges, and solutions

Tan

Liu³

et al. 2023

Front. Optoelectron.

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Due to the rise of 5G, IoT, AI, and high-performance computing applications, datacenter traffic has grown at a compound annual growth rate of nearly 30%. Furthermore, nearly three-fourths of the datacenter traffic resides within datacenters. The conventional pluggable optics increases at a much slower rate than that of datacenter traffic. The gap between application requirements and the capability of conventional pluggable optics keeps increasing, a trend that is unsustainable. Co-packaged optics (CPO) is a disruptive approach to increasing the interconnecting bandwidth density and energy efficiency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics. CPO is widely regarded as a promising solution for future datacenter interconnections, and silicon platform is the most promising platform for large-scale integration. Leading international companies (e.g., Intel, Broadcom and IBM) have heavily investigated in CPO technology, an inter-disciplinary research field that involves photonic devices, integrated circuits design, packaging, photonic device modeling, electronic-photonic co-simulation, applications, and standardization. This review aims to provide the readers a comprehensive overview of the state-of-the-art progress of CPO in silicon platform, identify the key challenges, and point out the potential solutions, hoping to encourage collaboration between different research fields to accelerate the development of CPO technology. Graphical Abstract

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“…As is discussed toward the end of the paper, a great deal of research is currently underway into "copackaged optics" (CPO) for data center switch ASICs, which have aggregated bandwidths expected to exceed 100 Tb/s by 2026. Intel has been leading the effort to develop CPO based on silicon photonics microtransceivers or "chiplets" coassembled with switch ASICs onto common carriers [1][2][3] to accommodate these astronomical bandwidths in data center switch ASICs. However, the vast majority of systems in data centers, what we refer to as sub-TOR systems, are servers and data storage arrays, which in hyperscale data centers number in the hundreds of thousands.…”

Section: Introductionmentioning

confidence: 99%

Evolution of System Embedded Optical Interconnect in Sub-Top-of-Rack Data Center Systems

et al. 2022

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In this paper we review key technological milestones in system embedded optical interconnects in data centers that have been achieved between 2014 and 2020 on major European Union research and development projects. This includes the development of proprietary optically enabled data storage and switch systems and optically enabled data storage and compute subsystems. We report on four optically enabled data center system demonstrators: LightningValley, ThunderValley2, Pegasus and Aurora, which include advanced optical circuits based on polymer waveguides and fibers and proprietary electro-optical connectors. We also report on optically enabled subsystems including Ethernet-connected hard disk drives and microservers. Both are designed in the same pluggable carrier form factor and with embedded optical transceiver and connector interfaces, thus allowing, for the first time, both compute and storage nodes to be optically interchangeable and directly interconnectable over long distances. Finally, we present the Nexus platform, which allows different optically enabled data center test systems and subsystems to be interconnected and comparatively characterized within a data center test environment.

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Co-Packaged Photonics For High Performance Computing: Status, Challenges And Opportunities

Cited by 54 publications

References 29 publications

2.5D Heterogeneous Integration for Silicon Photonics Engines in Optical Transceivers

2.5D Heterogeneous Integration for Silicon Photonics Engines in Optical Transceivers

Co-packaged optics (CPO): status, challenges, and solutions

Evolution of System Embedded Optical Interconnect in Sub-Top-of-Rack Data Center Systems

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