Chip package interaction (CPI): Thermo mechanical challenges in 3D technologies

González, Mario; Vandevelde, Bart; Ivankovic, A.; Cherman, Vladimir; Debecker, Bjorn; Lofrano, Melina; Wolf, Ingrid De; Beyer, Gerald; Swinnen, Bart; Tőkei, Zs.; Beyne, Eric

doi:10.1109/eptc.2012.6507142

Cited by 22 publications

(6 citation statements)

References 18 publications

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“…The sub-model provided results at the corner C4 bump region for BEOL fracture (ULK fracture or delamination). The most significant stress in BEOL layers is in the normal (through-thickness) direction as described in [9], [12]. The results are summarized in the following subsections.…”

Section: B Simulationmentioning

confidence: 97%

“…The die, UF, substrate and ring attach adhesive incorporated temperature dependent CTE values. Material properties for the die BEOL were calculated based on averaging the actual USG, Low-K and ELK stack-up as described in [9]. The UF, ring attach adhesive and substrate moduli values were derived from the respective material's time-temperature master curves and were each represented in ANSYS by a multi-term Prony Series and a Williams-Landel-Ferry shift function.…”

Section: Simulation Modelmentioning

confidence: 99%

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Influence of Thermally Aged Underfill on Flip-Chip Packages

Cox,

Abu-Hamdeh,

Borden

2024

IMAPSource Proceedings

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Underfill material plays a crucial role in flip-chip package reliability, thus it necessary to accurately understand the mechanical properties. The material itself is nonlinear and is dependent on degree of cure, temperature, strain rate and thermal aging, among others. In this work, two underfill materials were characterized for thermal expansion and viscoelastic properties over a wide temperature range. A second set of each material was thermally aged through flip-chip processing steps and 250 thermal cycles and then characterized. Temperature dependent thermal expansion and timetemperature dependent moduli curves were generated to represent each material type. These material models were then implemented into a nonlinear finite element model of a flip-chip package to evaluate package stress interaction through processing steps and thermal cycling. The influence that each underfill material had with and without thermal aging was analyzed with respect to typical package failure mechanisms.

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Section: B Simulationmentioning

confidence: 97%

Section: Simulation Modelmentioning

confidence: 99%

Influence of Thermally Aged Underfill on Flip-Chip Packages

Cox,

Abu-Hamdeh,

Borden

2024

IMAPSource Proceedings

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“…For each configuration from figure 3, three tensile loads, 3 shear loads and I thermal load where simulated in order to calculate the orthotropic equivalent thermal and mechanical properties: Young's moduli Ell, E22, E33; shear moduli G12, G23, G31; Poisson's ratios VIZ, V23, V31 and thermal expansion coefficients CXI, CXz and CX3. For more details about the method used to calculate the equivalent properties see [3]. Figure 3.…”

Section: Packaging Effectmentioning

confidence: 99%

“…Then, these temperature changes cause thermo-mechanical stresses and warpage inside the 3D-IC package, due to the mismatch in thermal expansion coefficient (CTE) and Young's modulus between the constituent materials of the package. Thus, the thermo-mechanical reliability of the 3D-[C packages is one of the major concerns [3][4].…”

Section: Introductionmentioning

confidence: 99%

Die thickness impact on thermo-mechanical stress in 3D packages

Salahouelhadj

González

Oprins

2015

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

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In this study, Finite Element Modeling (FEM) is used to predict the stress and deformation induced by packaging and temperature hot spots for 3D-IC packages. The studied packages consist of a stack of two Si dies attached with flip chip technology to a laminate in a ball grid array (BGA) configuration. Three packages were considered in this paper: two molded packages with different epoxy mold compounds (EMCs) and one bare die package without EMC. The impact of the bottom die thickness on the stress and package deformation is investigated.The finite element simulation results indicate that thinning the bottom die will cause larger stress and more warpage induced by packaging. Moreover, temperature hot spots cause larger stress and more deformation for thinner bottom dies. Furthermore, the results show that the stress and deformation caused by processing are much higher than those induced by temperature hot spots.

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“…During their processing or due to the application of power during their operating time, the IC packages are subjected to temperature changes or gradients. These temperature changes makes the materials with different Coefficient of Thermal Expansion (CTE) to expand or contract at different rates inducing thermo-mechanical stresses and increasing the risk of cracks or delamination at the interfaces of the IC-package [1][2]. Therefore, accurate CTE measurements are of great importance for reliability assessment of the packages.…”

Section: Introductionmentioning

confidence: 99%

CTE measurements for 3D package substrates using Digital Image Correlation

Salahouelhadj

González

2016

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

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Thermo-mechanical stresses are often induced during processing of IC-packages. This is mainly due the Coefficient of Thermal Expansion (CTE) mismatch between the materials used to make these packages. Therefore, accurate CTE measurements is of great importance. In this study in-plane CTE measurements were conducted for thin film samples using Digital Image Correlation (DIC). The methodology was validated using copper test samples. Two different package substrates were characterized. DIC technique was compared to Thermal Mechanical Analysis (TMA) technique. The CTE measured by DIC is about 25-33% higher than TMA.Finally, some experimental and numerical tests were conducted to assess errors related to DIC technique. Both numerical and experimental tests, based on rigid-body motion were conducted. They allow to assess the errors related to lighting, the optical lens distortion, the noise due to CCD sensor and heat radiation, the out-of-plane displacement and the correlation algorithm.

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Chip package interaction (CPI): Thermo mechanical challenges in 3D technologies

Cited by 22 publications

References 18 publications

Influence of Thermally Aged Underfill on Flip-Chip Packages

Influence of Thermally Aged Underfill on Flip-Chip Packages

Die thickness impact on thermo-mechanical stress in 3D packages

CTE measurements for 3D package substrates using Digital Image Correlation

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