Abstract:Thermo-mechanical stresses are often induced during processing of IC-packages. This is mainly due the Coefficient of Thermal Expansion (CTE) mismatch between the materials used to make these packages. Therefore, accurate CTE measurements is of great importance. In this study in-plane CTE measurements were conducted for thin film samples using Digital Image Correlation (DIC). The methodology was validated using copper test samples. Two different package substrates were characterized. DIC technique was compared … Show more
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