2016
DOI: 10.1039/c5tc03766b
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Carrier confinement effect-driven channel design and achievement of robust electrical/photostability and high mobility in oxide thin-film transistors

Abstract: Carrier confinement effect-driven channel structures promoted stability under photo-bias stress condition, which was attributed increased recombinations events between photo-ionized oxygen vacancies and charged electrons due to the effective carrier confinement.

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Cited by 14 publications
(11 citation statements)
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“…It facilitates conformal material deposition with a high degree of reproducibility of thin layered films with a superior control over film thickness due to its intrinsic reaction-controlled film deposition. This advantage allows the possibility of precise deposition over large-area substrates, either planar or three-dimensional structured with precise thickness control at angstrom levels, which is enabled by surface-limited reactions of the molecular precursors employed. In this context, heterostructure devices based on aluminum oxide/zinc oxide and aluminum oxide/indium oxide compositions have been demonstrated, showing considerable evidence of tunability of their properties in favor of high-performance semiconductor/conductor behavior. , Thus, the ALD technique offers its largely underutilized potential to take advantage of such phenomena arising at the heterointerface and enabling their fine-tuning on a more or less atomic scale. ,, In this realm, we have recently reported on multilayered heterostructures obtained by ALD, consisting of alternating layers of In 2 O 3 and ZnO …”
Section: Introductionmentioning
confidence: 99%
“…It facilitates conformal material deposition with a high degree of reproducibility of thin layered films with a superior control over film thickness due to its intrinsic reaction-controlled film deposition. This advantage allows the possibility of precise deposition over large-area substrates, either planar or three-dimensional structured with precise thickness control at angstrom levels, which is enabled by surface-limited reactions of the molecular precursors employed. In this context, heterostructure devices based on aluminum oxide/zinc oxide and aluminum oxide/indium oxide compositions have been demonstrated, showing considerable evidence of tunability of their properties in favor of high-performance semiconductor/conductor behavior. , Thus, the ALD technique offers its largely underutilized potential to take advantage of such phenomena arising at the heterointerface and enabling their fine-tuning on a more or less atomic scale. ,, In this realm, we have recently reported on multilayered heterostructures obtained by ALD, consisting of alternating layers of In 2 O 3 and ZnO …”
Section: Introductionmentioning
confidence: 99%
“…However, in order to realize high definition, high frame-rate displays, and the relevant driving circuitry, the carrier mobility must be further improved while exhibiting good operational stability. For these reasons, various metal-oxide semiconductors [ 7 , 8 ], gate dielectrics [ 9 , 10 ], novel device structures [ 11 , 12 ], and post treatments [ 13 , 14 ] have been proposed to enhance the carrier mobility of these devices. Among the various approaches in achieving high mobility metal-oxide TFTs, using an ionic-type gate dielectric is a promising method of achieving both the high mobility and low voltage operation characteristics [ 15 , 16 , 17 , 18 , 19 ].…”
Section: Introductionmentioning
confidence: 99%
“…Moreover, the hysteretic phenomenon reduces in the transfer curves of Nd:IZO/Al 2 O 3 TFT. According to our previous study [ 11 ] and other reports [ 12 , 13 ], the Al 2 O 3 acts as an electrical controller layer, inducing high-flux electron movement in the bulk and near-channel regions of the semiconductor layer by the carrier confinement effect under an electrical field, which avoids the scatting and trapping effect by the back-channel defects, and hence efficiently improves the device’s mobility. Meanwhile, in the Nd:IZO/Al 2 O 3 system, the Al 2 O 3 layer should have a specific role in the modification of the Nd:IZO semiconductor layer, which will be further discussed in this paper.…”
Section: Resultsmentioning
confidence: 99%