Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) 2011
DOI: 10.1109/isse.2011.6053943
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Application of copper-Carbon Nanotubes composite in packaging interconnects

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Cited by 8 publications
(2 citation statements)
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“…To circumvent this issue, combinations of CNTs with copper were envisioned soon after the pioneering studies about CNT interconnects [80]. In [81,82,83], initial experiments were conducted on "bulk" approach where a mixture of CNTs and Cu is deposited from a solution to target substrate. This approach demonstrated a mitigated performance for interconnects such that the focus now is exclusively on composite materials where CNT alignment is controlled by current flow (referred to as aligned CNT-Cu composite).…”
Section: B Composite Cntsmentioning
confidence: 99%
“…To circumvent this issue, combinations of CNTs with copper were envisioned soon after the pioneering studies about CNT interconnects [80]. In [81,82,83], initial experiments were conducted on "bulk" approach where a mixture of CNTs and Cu is deposited from a solution to target substrate. This approach demonstrated a mitigated performance for interconnects such that the focus now is exclusively on composite materials where CNT alignment is controlled by current flow (referred to as aligned CNT-Cu composite).…”
Section: B Composite Cntsmentioning
confidence: 99%
“…CNTscomposite materials are constructed, based on two approaches to obtain new materials with improved properties. The first approach depends on synthesis of CNTs with other materials through different chemical procedures, in order to construct new materials based-CNTs [15][16][17][18][19]. Meanwhile, the second approach depends on coating CNTs (SWCNTs and MWCNTs) by other materials, in order to improve the surfaces properties of CNTs.…”
Section: Introductionmentioning
confidence: 99%