2016
DOI: 10.1007/s12648-016-0918-6
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Analytical threshold voltage modeling of ion-implanted strained-Si double-material double-gate (DMDG) MOSFETs

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Cited by 12 publications
(2 citation statements)
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“…The performance of the proposed s‐Si GC‐DMDG MOSFET is compared with the previous works, as demonstrated in Table 1. It is observed from Table 1 that the proposed s‐Si GC‐DMDG device has lower I OFF , higher I ON / I OFF ratio, and lower SS compared to s‐Si GC‐DG device and Guassian doped s‐Si DMDG MOSFET with channel length 40 nm 21,35 . Besides, the proposed s‐Si GC‐DMDG MOSFET has higher I ON / I OFF ratio than DMG junction less MOSFET with channel length of 80 nm 36 .…”
Section: Resultsmentioning
confidence: 90%
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“…The performance of the proposed s‐Si GC‐DMDG MOSFET is compared with the previous works, as demonstrated in Table 1. It is observed from Table 1 that the proposed s‐Si GC‐DMDG device has lower I OFF , higher I ON / I OFF ratio, and lower SS compared to s‐Si GC‐DG device and Guassian doped s‐Si DMDG MOSFET with channel length 40 nm 21,35 . Besides, the proposed s‐Si GC‐DMDG MOSFET has higher I ON / I OFF ratio than DMG junction less MOSFET with channel length of 80 nm 36 .…”
Section: Resultsmentioning
confidence: 90%
“…It is observed from Table 1 that the proposed s-Si GC-DMDG device has lower I OFF , higher I ON /I OFF ratio, and lower SS compared to s-Si GC-DG device and Guassian doped s-Si DMDG MOSFET with channel length 40 nm. 21,35 Besides, the proposed s-Si GC-DMDG MOSFET has higher I ON /I OFF ratio than DMG junction less MOSFET with channel length of 80 nm. 36 Therefore, the proposed s-Si GC-DMDG MOSEFT has attained improved subthreshold characteristics using DMG structure with graded channel engineering.…”
Section: Resultsmentioning
confidence: 98%