Analysis of residual errors due to calibration transfer in on-wafer measurements at mm-wave frequencies

Galatro, L.; Spirito, M.

doi:10.1109/bctm.2015.7340569

Cited by 5 publications

(4 citation statements)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The process of transferring the first-tier calibration to another structure assumes that the delta capacitance introduced by changing the substrate under the probes (i.e., boundary conditions) is negligible. As it was shown in [8], this capacitance is dependent on the probe topology and substrate characteristic, creating a coupling that increases with frequencies.…”

mentioning

confidence: 89%

“…The impedance extracted using the method in [22] presents some fluctuations, which can be attributed to the inductive nature of the probe to pad transition (i.e., step in transmission linewidth). Moreover, both the mentioned techniques suffer from the errors arising from the calibration transfer from the fused silica substrate as described in [8]. It is interesting to notice from Fig.…”

Section: A Z 0 Extraction Proceduresmentioning

confidence: 99%

“…Moreover, the onset of spurious modes on "electrically thick" substrates like the alumina ISS (ε r = 9.6, thickness = 254 μm) can affect the accuracy of the calibration, intrinsically based on single mode propagation, as described in [29]. Finally, with the frequency increase toward the (sub) millimeter-wave region, the effect of the probe to substrate coupling in the transfer of calibration among different calkits (i.e., difference in ε r ) can become an important contribution to the calibration error, as described in [8].…”

Section: Comparison Of Probe Tip Calibrationsmentioning

confidence: 99%

See 2 more Smart Citations

Millimeter-Wave On-Wafer TRL Calibration Employing 3-D EM Simulation-Based Characteristic Impedance Extraction

Galatro

Spirito

2017

IEEE Trans. Microwave Theory Techn.

View full text Add to dashboard Cite

In this paper, we propose a method based on 3-D electromagnetic simulations, for the characteristic impedance extraction of transmission lines employed in TRL calibration, focusing on lines integrated in silicon technologies. The accuracy achieved with TRL calibrations using the proposed characteristic impedance extraction is benchmarked versus conventional approaches, with an emphasis on aluminum pads structures operating in the (sub) millimeter-wave range. The proposed method proves to be insensitive to common sources of error (i.e., large pad capacitance and inductive pad-to-line transitions), which affect the accuracy of characteristic impedance extraction based on measurements, especially as the testing frequency increases. First, direct on-wafer TRL calibrations are performed on uniform CPWs (i.e., with no pads discontinuities) to demonstrate how the proposed method performs as good as the calibration comparison method and outperforms calibration transfer approaches. Finally, the method is applied to a nonuniform CPW-based calibration kit, demonstrating how the proposed method provides accurate results, improving the calibration quality that can be achieved using the calibration comparison method when inductive pad-toline transitions are present.

show abstract

mentioning

confidence: 89%

Section: A Z 0 Extraction Proceduresmentioning

confidence: 99%

Section: Comparison Of Probe Tip Calibrationsmentioning

confidence: 99%

See 1 more Smart Citation

Millimeter-Wave On-Wafer TRL Calibration Employing 3-D EM Simulation-Based Characteristic Impedance Extraction

Galatro

Spirito

2017

IEEE Trans. Microwave Theory Techn.

View full text Add to dashboard Cite

show abstract

“…In [1], the probe-to-substrate interaction is identified as the dominant uncertainty source in transfer of traceability between different substrate materials. Furthermore, accurate definition of the measurement reference plane position is critical for probe-independent characterization of device S-parameters [2].…”

Section: Introductionmentioning

confidence: 99%

Parameterization Models for Traceable Characterization of Planar CPW SOL Calibration Standards

Mubarak

Mascolo

Rietveld

et al. 2018

2018 Conference on Precision Electromagnetic Measurements (CPEM 2018)

Self Cite

View full text Add to dashboard Cite

Methods for traceable characterization and uncertainty evaluation of planar 1-port CPW short-open-load (SOL) devices are developed. The agreement of modelling and verification measurement results greatly supports the application of the proposed parameterization models and used FEM-based EM modelling of CPW structures for traceable characterization of planar CPW-based SOL devices in the frequency range between a few kHz up to 50 GHz.

show abstract

On the Impact of Radiation Losses in TRL Calibrations

Spirito

Martino

Galatro

2018

2018 91st ARFTG Microwave Measurement Conference (ARFTG)

View full text Add to dashboard Cite

Analysis of residual errors due to calibration transfer in on-wafer measurements at mm-wave frequencies

Cited by 5 publications

References 5 publications

Millimeter-Wave On-Wafer TRL Calibration Employing 3-D EM Simulation-Based Characteristic Impedance Extraction

Millimeter-Wave On-Wafer TRL Calibration Employing 3-D EM Simulation-Based Characteristic Impedance Extraction

Parameterization Models for Traceable Characterization of Planar CPW SOL Calibration Standards

On the Impact of Radiation Losses in TRL Calibrations

Contact Info

Product

Resources

About