Analysis of drying shrinkage and flow due to surface tension of spin-coated films on topographic substrates

Hirasawa, Shigeki; Saito, Yoko; Nezu, H.; Ohashi, N.; Maruyama, P.

doi:10.1109/66.641486

Cited by 16 publications

(17 citation statements)

References 8 publications

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“…A void-free and cost-effective method to fill HAR gaps is by using spin-on glass (SOG). Because of its low viscosity, SOG can easily reach the bottom of the narrow and HAR gaps, and completely fill them without voids while planarizing the surface [11], [14]. Hence, SOG (Accuglass 512B by Honeywell, Inc.) is chosen for our application.…”

Section: Versatile Chip-specific Integration Technology (Vcsit)mentioning

confidence: 99%

Wafer Scale Integration of CMOS Chips for Biomedical Applications via Self-Aligned Masking

Uddin

Milaninia

Chen

et al. 2011

IEEE Trans. Compon., Packag. Manufact. Technol.

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This paper presents a novel technique for the integration of small CMOS chips into a large area substrate. A key component of the technique is the CMOS chip based self-aligned masking. This allows for the fabrication of sockets in wafers that are at most 5 µm larger than the chip on each side. The chip and the large area substrate are bonded onto a carrier such that the top surfaces of the two components are flush. The unique features of this technique enable the integration of macroscale components, such as leads and microfluidics. Furthermore, the integration process allows for MEMS micromachining after CMOS die-wafer integration. To demonstrate the capabilities of the proposed technology, a low-power integrated potentiostat chip for biosensing implemented in the AMI 0.5 µm CMOS technology is integrated in a silicon substrate. The horizontal gap and the vertical displacement between the chip and the large area substrate measured after the integration were 4 µm and 0.5 µm, respectively. A number of 104 interconnects are patterned with high-precision alignment. Electrical measurements have shown that the functionality of the chip is not affected by the integration process.

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Section: Versatile Chip-specific Integration Technology (Vcsit)mentioning

confidence: 99%

Wafer Scale Integration of CMOS Chips for Biomedical Applications via Self-Aligned Masking

Uddin

Milaninia

Chen

et al. 2011

IEEE Trans. Compon., Packag. Manufact. Technol.

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“…The molecular weights of PS and PEO are 20 000 g mol − 1 and 6500 g mol − 1 , respectively, corresponding to a 22% minority www.mcp-journal.de Macromolecular Chemistry and Physics www.MaterialsViews.com with the block copolymer fi lm, because of the planarization of the fi lm arising from the capillary-driven fl ow. [33][34][35] After transfer printing of dewetted droplets on the periodically modifi ed Au substrate with alternating stripes of hydrophobic and hydrophilic surfaces, the transferred droplets can be transformed to non-circular ones upon solvent annealing. The effective modulation of the spreading of the transferred droplets on the chemically periodic surface during solvent annealing led to micropatterns of non-circular droplets with various shapes.…”

Section: Methodsmentioning

confidence: 99%

Micropatterns of Non‐Circular Droplets of Nanostructured PS‐b‐PEO Copolymer by Solvent‐Assisted Wetting on a Chemically Periodic Surface

Kim

Park

Song

et al. 2012

Macro Chemistry & Physics

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A method to fabricate micropatterns of non-circular droplets of a self-assembled block copoly mer by solvent-assisted wetting on chemically periodic surface is presented. The block copolymer is dewetted on a topographic pre-pattern to form an array of microdroplets with a sphere-capped shape and circular contact line. The droplets are then transferred onto a chemically periodic Au line pattern microcontact-printed with two types of self-assembled monolayers (SAMs). Solvent vapor application provides suffi cient mobility to the block copolymer molecules to induce spreading of the transferred droplets, resulting in two types of non-circular microdroplet growth. The growth behavior depends on the size of initial droplets relative to periodic line width and on the initial registries of as-transferred droplets. offered a great potential in virtue of their diverse structural motifs and the facile tunability of the structures. [6][7][8][9][10][11][12][13][14][15][16] The simple and cost effective characteristics of the block copolymers have drawn many emerging applications in nanotechnology such as materials for nanolithography, photonic crystals, polymer solar cells, nanotemplates for harvesting metals and semiconductors, and as drug carriers. [6][7][8][9][10][11][12][13][14][15][16] Surface wetting or dewetting of thin block copolymer fi lms has been often utilized as an effective route for fabricating interesting hierarchical structures. [12][13][14][15][16][17][18][19] When a self-assembled block copolymer with an ordered structure is employed for either wetting or dewetting on a hard surface, the resulting sphere-capped droplets contain not only the fi rst layered terrace directly on the solid surface, frequently known as a brush layer, but also multiple terraces stacked in the direction of fi lm thickness. [ 17 , 18 ] Understanding of the hierarchically ordered droplets of a block copolymer has been in details made by several theoretical [ 6 ] and experimental studies. [ 17 , 20 ] For instance, disklike concentric rings with a characteristic periodicity of the poly(styrene-block -methylmethacrylate) microphase separation were successively piled up in droplets whose cross section resembled a triangle with a stepped side profi le. [ 17 ]

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“…37,38 In this work, we ignored the effect of centrifugal force and assimilated the solvent to water. First, initial water concentration (C 0 ) is calculated:…”

Section: Mechanical Modelsmentioning

confidence: 99%

Mechanical analysis of interconnected structures using process simulation

Senez

Hoffmann

Duc

et al. 2003

Journal of Applied Physics

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An elastoplastic model has been implemented in a technology computer-aided design (TCAD) program with the aim of predicting the mechanical behavior of polycrystalline materials used in silicon-based technology in microelectronics. In order to analyze microstructures combining both nonlinear viscoelastic and elastoplastic materials, we propose a computational process with quick convergence. This model is now included in a stress simulation system, thus allowing the prediction of variations in stress according to the stage of the process. The modeling takes into account not only thermal stress but also intrinsic/extrinsic stresses and etching-related stress. The stress evolution of aluminum copper (Al–Cu) periodic lines embedded within silicon dioxide has been examined. The tensile and compressive yield strengths of thin-film Al–Cu have been characterized using the von Mises criterion for various film thicknesses. Comparisons with experimental results, based on passivated and unpassivated line structures, show that von Mises yield stress is independent of linewidth. It was also found that the correct prediction of the principal stresses strongly depends on the accurate characterization of thin-film yield strength. The use of incorrect values can lead to large errors in the determination of the line aspect ratio giving the maximum principal stresses. Finally, the analysis of an industrial back end of line process is performed to demonstrate what we can now carry out with TCAD to solve stress-related reliability problems in interconnects.

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Analysis of drying shrinkage and flow due to surface tension of spin-coated films on topographic substrates

Cited by 16 publications

References 8 publications

Wafer Scale Integration of CMOS Chips for Biomedical Applications via Self-Aligned Masking

Wafer Scale Integration of CMOS Chips for Biomedical Applications via Self-Aligned Masking

Micropatterns of Non‐Circular Droplets of Nanostructured PS‐b‐PEO Copolymer by Solvent‐Assisted Wetting on a Chemically Periodic Surface

Mechanical analysis of interconnected structures using process simulation

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