Aging induced structural and electrochemical corrosion behaviour of Sn-1.0Ag-0.5Cu and Sn-3.8Ag-0.7Cu solder alloys

Kaushik, Raj Kumar; Batra, Uma; Sharma, Jagmohan

doi:10.1016/j.jallcom.2018.01.292

Cited by 34 publications

(7 citation statements)

References 25 publications

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“…3, even at the end of the scanning region (+1.0 V) pseudo-passivation region holds. This is different from the observed behavior reported by other studies which mainly used NaCl-based solutions [22,23]. The quantitative results of potentiodynamic polarization measurements are given in Table 2.…”

Section: Potentiodynamic Polarization Analysiscontrasting

confidence: 80%

Hidroklorik Asit çözeltisinde bizmut ilavesinin Sn – 3Ag – 0.5Cu lehim alaşımının korozyon dinamiklerine etkisi

Erer

2021

International Journal of Innovative Engineering Applications

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Original scientific paperThis study aims to investigate the effects of bismuth addition on the corrosion behaviour of Sn-3.0Ag-0.5Cu (SAC 305) solder alloy in 1M HCl acid solution under potentiodynamic polarization. After electrochemical tests, scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDX) were used to examine and characterize the properties of the samples. Polarization studies indicate that the addition of 0.5, 1, and 2 wt.% Bi in the SAC305 solder alloy does not significantly change the corrosion potentials. Instead of a true passivation region, a pseudo-passivation region is observed in which currents are nearly constant (though high). This pseudo-passive region does not include a reactivation point within the scanning interval. On the other hand, the corrosion rates follow a pattern in which 1 wt.% bismuth replacement of silver causes a decrement in corrosion rate. However, the corrosion rate increases with the further replacement of silver with bismuth. Microstructure analysis reveals the existence of gaps and porosities which introduce limits on the formation and stability of protective passive corrosion products.

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Section: Potentiodynamic Polarization Analysiscontrasting

confidence: 80%

Hidroklorik Asit çözeltisinde bizmut ilavesinin Sn – 3Ag – 0.5Cu lehim alaşımının korozyon dinamiklerine etkisi

Erer

2021

International Journal of Innovative Engineering Applications

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“…All of the samples were directly subjected to polarization characterization after the CA at selected peak potential had been completed (Figure 7a-c). The polarization curve of SAC305 prior to CA had shown the dissolution potential to be at −0.52 V (Figure 7d, Table II), which was attributed to the dissolution of β-Sn from the (Kaushik et al , 2018). A similar result was also obtained for the CA48 sample, as the β-Sn phase had not been completely removed from this sample during the CA, as had been discussed earlier (Section 2.3).…”

Section: Resultsmentioning

confidence: 99%

Investigation of anodic dissolution behaviour of intermetallic compound in Sn-3Ag-0.5Cu solder alloy by cyclic voltammetry

Ahmad

Seman

Mohamad

2019

SSMT

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Purpose The purpose of this paper is to study the mechanism of electrochemical dissolution of SAC305 solder in mild acid solution. Design/methodology/approach Cyclic voltammetry (CV) was used to obtain electrochemical dissolution peaks followed by chronoamperometery (CA) to investigate the dissolution mechanism at each peak. Structural and microstructural characterization was performed to verify the CA analysis. Potentiodynamic polarization was performed afterwards to determine the corrosion potential of every phase in SAC305. Findings The early cycle of CV exhibits only dissolution peaks of β-Sn until intermetallic compound (IMC) peaks emerged at a later cycle. CA performed for 24 h at selected potentials reveals that β-Sn can be removed completely from the sample without disrupting the IMC network at a suitable potential. This was later verified by XRD and SEM. Potentiodynamic polarization determined the corrosion potential of IMC as −0.36 V. Originality/value The mechanism of anodic dissolution of SAC305 was studied and proposed.

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“…The most important factor with SAC family solder alloys is the formation of undesirable intermetallic compounds (IMCs) such as Ag3Sn and Cu6Sn5. These IMCs layers adversely solder alloys affect corrosion resistance and mechanical properties (Kaushik, 2018).…”

Section: Introductionmentioning

confidence: 99%

“…Proper product life can be predicted if the corrosion behav-ior of Pb-free solders is properly investigated and under-stood (Nazeri, 2019). Therefore, information about the microstructural changes, morphology, and growth behavior of the layers of IMCs and their effects on corrosion resistance is crucial to understanding the reliability of SAC-based soldering (Kaushik, 2018). Numerous studies have been conducted on the corrosion behavior of SAC305 solder alloy in solutions (such as NaCl solution) (Mohanty, 2008;Rosalbino, 2009;Osorio, 2011).…”

Section: Introductionmentioning

confidence: 99%

The Effect Of Indium Addition on The Corrosion Kinetics of Sn–3Ag–0.5Cu Alloy In HCl Acid Solution

Oguz¹,

Erer²,

Türen³

et al. 2022

European Journal of Science and Technology

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The aim of this study is to investigate the corrosion behavior of potentiodynamic polarization indium added Sn-3Ag-0.5Cu alloy in 1M HCl solution. SEM and EDX analyses were examined the properties of the alloy samples. Polarization analyses showed by the addition of 0.5, 1, and 2 wt.% indium to the SAC305 solder alloy does not lead to notably different corrosion potentials. The pseudo-passivation region is observed instead of a true passivation region that currents are nearly constant. By the scanning interval, this pseudo-passive region does not have a reactivation point. On the other hand, corrosion rates follow a pattern in which 0.5% wt of indium substitution of silver causes the corrosion rate to decrease. However, with further silver replacement by indium, the rate of corrosion increases. According to the results of microstructure analysis, the formation of corrosion products and the existence of voids and porous structures limit their stability.

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Aging induced structural and electrochemical corrosion behaviour of Sn-1.0Ag-0.5Cu and Sn-3.8Ag-0.7Cu solder alloys

Cited by 34 publications

References 25 publications

Hidroklorik Asit çözeltisinde bizmut ilavesinin Sn – 3Ag – 0.5Cu lehim alaşımının korozyon dinamiklerine etkisi

Hidroklorik Asit çözeltisinde bizmut ilavesinin Sn – 3Ag – 0.5Cu lehim alaşımının korozyon dinamiklerine etkisi

Investigation of anodic dissolution behaviour of intermetallic compound in Sn-3Ag-0.5Cu solder alloy by cyclic voltammetry

The Effect Of Indium Addition on The Corrosion Kinetics of Sn–3Ag–0.5Cu Alloy In HCl Acid Solution

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