The Effect Of Indium Addition on The Corrosion Kinetics of Sn–3Ag–0.5Cu Alloy In HCl Acid Solution

Abstract

The aim of this study is to investigate the corrosion behavior of potentiodynamic polarization indium added Sn-3Ag-0.5Cu alloy in 1M HCl solution. SEM and EDX analyses were examined the properties of the alloy samples. Polarization analyses showed by the addition of 0.5, 1, and 2 wt.% indium to the SAC305 solder alloy does not lead to notably different corrosion potentials. The pseudo-passivation region is observed instead of a true passivation region that currents are nearly constant. By the scanning interval, this pseudo-passive region does not have a reactivation point. On the other hand, corrosion rates follow a pattern in which 0.5% wt of indium substitution of silver causes the corrosion rate to decrease. However, with further silver replacement by indium, the rate of corrosion increases. According to the results of microstructure analysis, the formation of corrosion products and the existence of voids and porous structures limit their stability.