Abstract:This paper summarizes the adhesion test standard and technique developed collectively by groups from the IBM Research Division, Yorktown Heights, and the Development Laboratory of IBM Microelectronics Division at East Fishkill. This activity was initiated since the increased complexity of interconnection technologies require a large number of interfaces to maintain their integrity while being subjected to a large variety of processes. For example, reliable adhesion of polymer layers to metals and ceramics play… Show more
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