A two-chip accelerometer system for automotive applications

Shemansky, Frank A.; Ristic, L.; Koury, D.; Joseph, Eric

doi:10.1007/bf01294802

Cited by 24 publications

(6 citation statements)

References 14 publications

(17 reference statements)

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“…This process was developed in the early 1990s (Ristic et al 1992, Shemansky et al 1995, and surface micromachining was used. This process was developed in the early 1990s (Ristic et al 1992, Shemansky et al 1995, and surface micromachining was used.…”

Section: Motorola's Surface Micromachined Z-axis Capacitive Accelerommentioning

confidence: 99%

Accelerometers

Xie

Fedder

Sulouff

2008

Comprehensive Microsystems

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Section: Motorola's Surface Micromachined Z-axis Capacitive Accelerommentioning

confidence: 99%

Accelerometers

Xie

Fedder

Sulouff

2008

Comprehensive Microsystems

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“…Some proposed applications include: accelerometers (Shemansky et al 1995;Davis et al 2006), pressure sensors (Goldman et al 1998), optical micromirrors (Dudley 2004), drug delivery systems (Gooray et al 2002) and passive and active radio frequency (RF) electrical components (Chapman 2006).…”

Section: Introductionmentioning

confidence: 99%

A Monte-Carlo simulation of the effect of surface morphology on the fracture of nanobeams

Alan

Zehnder

2007

Int J Fract

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Experiments show that the strength of nanostructures can be very high and that strength statistics are dominated by surface flaws. To understand the dependence of strength on the surface morphology, a series of fracture mechanics based Monte-Carlo simulations were performed. The surfaces of previously tested Si nanobeams were measured, statistically characterized and equivalent surfaces were generated. The surface profiles consist of bunched steps with varying heights and widths. At the root of each step, there is a stress singularity defined by a stress intensity factor. The beams were assumed to fail when the stress intensity factor anywhere on the surface exceeds the fracture toughness. In agreement with experiments, simulations show that even a small increase in the surface roughness results in a significant reduction in the strength of nanostructures. Thus, careful attention to the surfaces is essential for optimum strength and reliability at the nanoscale.

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“…Since then accelerometer technology has evolved significantly with two fundamental approaches, integrated single chip solutions and two chip accelerometer products. In 1995, Schemansky et al 2 described a two chip accelerometer system aimed primarily at the automotive airbag market. In either case, the microelectronic package must provide a) electronic interconnection, b) mechanical protection, c) environmental protection and where power is a consideration d) heat dissipation.…”

Section: Introductionmentioning

confidence: 99%

Standard semiconductor packaging for high-reliability low-cost MEMS applications

Harney

2005

SPIE Proceedings

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Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

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A two-chip accelerometer system for automotive applications

Cited by 24 publications

References 14 publications

Accelerometers

Accelerometers

A Monte-Carlo simulation of the effect of surface morphology on the fracture of nanobeams

Standard semiconductor packaging for high-reliability low-cost MEMS applications

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