Accelerometers

Xie, Huikai; Fedder, Gary K.; Sulouff, R.E.

doi:10.1016/b978-044452190-3.00053-7

Cited by 11 publications

(9 citation statements)

References 158 publications

(129 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Compared to piezoelectric and thermal accelerometers, capacitive accelerometers are more popular for applications on automotive and consumer electronics due to their high sensitivity, good temperature performance, low cost and easy integration with CMOS (Xie et al 2008). Accelerometers based on bulk micromachining, especially on siliconon-insulator (SOI) wafers, have been widely developed (Brosnihan et al 1997;Chen et al 2005;Xie et al 2011;Dong et al 2005).…”

Section: Introductionmentioning

confidence: 99%

A three-axis SOI accelerometer sensing with both in-plane and vertical comb electrodes

et al. 2011

View full text Add to dashboard Cite

A three-axis capacitive accelerometer based on silicon-on-insulator is designed and fabricated. In the accelerometer, totally eight groups of capacitors are compactly arranged around an octagonal proof mass. The four groups of capacitors along orthogonal direction with in-plane comb electrodes detect XY acceleration, while the other four groups of capacitors along diagonal direction with vertical comb electrodes detect Z acceleration. Measurements of in-plane and vertical motion by the respective in-plane and vertical comb electrodes enable direct detection for all the three axes with differential capacitive sensing scheme. For the fabricated accelerometer in the size of 4 9 4 mm 2 , the capacitance sensitivities of in-plane and outof-plane accelerometers are 145.3 and 9.1 fF/g, respectively.

show abstract

Section: Introductionmentioning

confidence: 99%

A three-axis SOI accelerometer sensing with both in-plane and vertical comb electrodes

et al. 2011

View full text Add to dashboard Cite

show abstract

“…The first micromachined accelerometer was developed in the late 1970s based on the piezoresistive effect and a bulk micromachining process [1]. Since then, accelerometers based on different sensing methods and fabrication techniques have been introduced [2]. For example, piezoelectric, thermal, optical, capacitive, and tunneling accelerometers have been developed and fabricated with fabrication techniques such as bulk and surface micromachining [2].…”

Section: Introductionmentioning

confidence: 99%

“…Since then, accelerometers based on different sensing methods and fabrication techniques have been introduced [2]. For example, piezoelectric, thermal, optical, capacitive, and tunneling accelerometers have been developed and fabricated with fabrication techniques such as bulk and surface micromachining [2]. Today, the most common accelerometer, especially in automotive and consumer electronic applications, is the capacitive accelerometer fabricated with surface micromachining [2].…”

Section: Introductionmentioning

confidence: 99%

“…For example, piezoelectric, thermal, optical, capacitive, and tunneling accelerometers have been developed and fabricated with fabrication techniques such as bulk and surface micromachining [2]. Today, the most common accelerometer, especially in automotive and consumer electronic applications, is the capacitive accelerometer fabricated with surface micromachining [2]. Capacitive accelerometers offer high sensitivity, low power consumption, low sensitivity to changes in temperature, low fabrication cost, and ease of integration with CMOS technology [2], [3].…”

Section: Introductionmentioning

confidence: 99%

“…They typically consist of two electrodes with a voltage difference applied between them, with one electrode moving and one fixed. They usually come in two design flavors, parallel-plate and interdigitated electrodes [2]. In surface micromachining, the in-plane dimensions can be from a few microns to a few millimeters whereas the thicknesses are in the range of a few microns [2].…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Large-Stroke Capacitive MEMS Accelerometer Without Pull-In

2021

View full text Add to dashboard Cite

In this study, the feasibility of obtaining electrical read-out data from a capacitive MEMS accelerometer that employs repulsive electrode configuration is demonstrated. This configuration allows for large-stroke vibrations of microstructures without suffering from pull-in failure that exists in conventional accelerometers based on the parallelplate configuration. With initial fabrication gap of 2.75µm, the accelerometer can reach a 4.2µm dynamical displacement amplitude. The accelerometer is tested up to 95(V) without exhibiting pull-in failure. For comparison, the pull-in voltage of an accelerometer with same dimensions but with conventional parallel-plate electrode configuration is 0.8(V). The MEMS device is fabricated using the POLYMUMPs fabrication standard. An electrical circuit is built to measure the capacitance change due to motion of the accelerometer proof-mass. The accelerometer has a mechanical sensitivity of 35 nm g and electrical sensitivity of 5.3 mV g. The ability to use large bias voltages without the typical adverse effects on the stability of the moving electrode will enable the design of capacitive MEMS accelerometers with enhanced resolution and tunable frequency range.

show abstract