A preliminary solder joint life prediction model by experiment and simulation for translation of use condition to temperature cycling test condition

Han, Ru; Pei, Min; Lucero, Alan; Kwon, Daeil; Ge, Yun; Harries, Richard; Bhatti, Pardeep K.; Zheng, Tieyu

doi:10.1109/ectc.2013.6575669

Cited by 5 publications

(3 citation statements)

References 8 publications

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“…A fine representation of the BGA208 internal structure allows to better understand the thermal constraints encountered by the PWB soldered balls when the chip is active (Gao and Wang, 2014), especially at corner locations (Han et al , 2013). The Figure 8 highlights a thermal gradient of 48°C for the set of the interconnected balls.…”

Section: Identifying Bga-substrate Thermal Constraintsmentioning

confidence: 99%

State of the art of thermal characterization of electronic components using computational fluid dynamic tools

Monier-Vinard

Rogié

Bissuel

et al. 2017

HFF

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Purpose Latest Computational Fluid Dynamics (CFDs) tools allow modeling more finely the conjugate thermo-fluidic behavior of a single electronic component mounted on a Printed Wiring Board (PWB). A realistic three-dimensional representation of a large set of electric copper traces of its composite structure is henceforth achievable. The purpose of this study is to confront the predictions of the fully detailed numerical model of an electronic board to a set of experiment results to assess their relevance. Design/methodology/approach The present study focuses on the case of a Ball Grid Array (BGA) package of 208 solder balls that connect the component electronic chip to the Printed Wiring Board. Its complete geometrical definition has to be coupled with a realistic board layers layout and a fine description of their numerous copper traces to appropriately predict the way the heat is spread throughout that multi-layer composite structure. The numerical model computations were conducted on four CFD software then compare to experiment results. The component thermal metrics for single-chip packages are based on the standard promoted by the Joint Electron Device Engineering Council (JEDEC), named JESD-51. The agreement of the numerical predictions and measurements has been done for free and forced convection. Findings The present work shows that the numerical model error is lower than 2 per cent for various convective boundary conditions. Moreover, the establishment of realistic numerical models of electronic components permits to properly apprehend multi-physics design issues, such as joule heating effect in copper traces. Moreover, the practical modeling assumptions, such as effective thermal conductivity calculation, used since decades, for characterizing the thermal performances of an electronic component were tested and appeared to be tricky. A new approach based on an effective thermal conductivity matrix is investigated to reduce computation time. The obtained numerical results highlight a good agreement with experimental data. Research limitations/implications The study highlights that the board three-dimensional modeling is mandatory to properly match the set of experiment results. The conventional approach based on a single homogenous layer using effective thermal conductivity calculation has to be banned. Practical implications The thermal design of complex electronic components is henceforth under increasing control. For instance, the impact of gold wire-bonds can now be investigated. The three-dimensional geometry of sophisticated packages, such as in BGA family, can be imported with all its internal details as well as those of its associated test board to build a realistic numerical model. The establishment of behavioral models such as DELPHI Compact Thermal Models can be performed on a consistent three-dimensional representation with the aim to minimize computation time. Originality/value The study highlights that multi-layer copper trace plane discretization could be used to strongly reduce computation time while conserving a high accuracy level.

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Section: Identifying Bga-substrate Thermal Constraintsmentioning

confidence: 99%

State of the art of thermal characterization of electronic components using computational fluid dynamic tools

Monier-Vinard

Rogié

Bissuel

et al. 2017

HFF

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“…New packaging innovations drive many packaging solutions toward similar processes established in silicon processes. Although not reflected in the standards, metrics that leverage numerical simulation and data correlation are commonly used for reliability estimates and risk decisions [5,6]. Other chippackage interaction has been noted is bump-electromigration (EM) [7] where mechanical stress from the package impacts the bump EM result.…”

Section: End User Environmentmentioning

confidence: 99%

Package reliability and performance trends in an era of product integration

2014

2014 IEEE International Reliability Physics Symposium

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Product differentiation is expected to accelerate and will encompass integration of product functionality into single and multiple die on package as well as multiple die/packages on board. Novel packaging designs will lead to incorporation of new materials and processes from which a comprehensive understanding of operating conditions at system and subcomponent level will be required to ensure reliability at minimum impact to cost & performance. Reliability tests, models and analysis must evolve to encompass emerging failure mechanisms and geometric effects not considered when standards were originally authored. This manuscript will show trends in packaging and materials along with examples of emerging failure mechanisms that need to be understood to ensure reliability in highly integrated products.

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“…Presently, the majority of industry uses either JEDEC or power cycles [1,2] to determine the package temperature cycle requirements. Power cycles include both on-to-off and on-to-suspend event cycles.…”

Section: Introductionmentioning

confidence: 99%

Event-based use conditions method for thermo-mechanical reliability risk assessment

Sauciuc

Goyal

Pei

et al. 2014

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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The traditional approach of thermo-mechanical (T-M) reliability modeling is based on power cycle events. This approach is not useful for products which are rarely powered down, because power cycles alone do not capture all the reliability stress from temperature variation over these products' use life.This paper describes a methodology to determine the temperature cycle requirements for products like smartphones and tablets which accounts for the temperature variation associated with usage events, which we call "mini-cycles".The T-M model is based on the distribution of individual users' histories as a series of events over time, which is then translated into a temperature vs. time trace for each user. These temperature traces are then used as the main inputs to T-M models, for example using the Norris-Landzberg (N-L) acceleration model to evaluate solder damage for each user. Results are summarized in a distribution of T-M damage across all users. This new methodology improves the understanding of thermo-mechanical reliability requirements due to the impact of "mini-cycles".KEY WORDS: ther mo -mechanical, solder joint reliability, event-based use conditions, knowledge-based qualification. INTRODUCTIONPresently, the majority of industry uses either JEDEC or power cycles [1, 2] to determine the package temperature cycle requirements. Power cycles include both on-to-off and on-to-suspend event cycles. The temperature cycle (TC) requirement for a product is determined by assigning temperatures to each distinct, time-weighted state (on, suspend, off), and accounting for the number of events over the product lifetime as the input to the T-M reliability model, which may be based on Norris-Landzberg (N-L) model. However, for products that are not regularly power cycled, like smartphones and tablets, power cycles alone do not capture all the reliability stress from temperature variation over time. There is significant temperature (T) variation associated with application (app) usage which should be accounted for towards determining the TC requirement.Usage events, such as phone calls, represent a temperature vs. time behavior which we call a mini-cycle, to distinguish it from power cycles. A distribution of actual user app traces can be converted by modeling to a sequence of mini-cycles. It has been shown [3, 4] that mini-cycles may have a significant impact on T-M failure. The main subject of this paper is to convert user histories of events to T vs. time traces, which can be used as inputs for T-M modeling.New data was acquired for this work because previous user behavior studies [5,6] did not provide the detailed usage vs.

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A preliminary solder joint life prediction model by experiment and simulation for translation of use condition to temperature cycling test condition

Cited by 5 publications

References 8 publications

State of the art of thermal characterization of electronic components using computational fluid dynamic tools

State of the art of thermal characterization of electronic components using computational fluid dynamic tools

Package reliability and performance trends in an era of product integration

Event-based use conditions method for thermo-mechanical reliability risk assessment

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