A power inductor integration technology using a silicon interposer for DC-DC converter applications

Ding, Yixiao; Fang, Xiangming; Gao, Yuan; Cai, Yuanjing; Qiu, Xing; Mok, Philip K. T.; Lee, S. W. Ricky; Lau, Kei May; Sin, J.K.O.

doi:10.1109/ispsd.2018.8393674

Cited by 4 publications

(1 citation statement)

References 11 publications

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“…16(d). The inductance can be up to several µH and the size of the system can be reduced by 5 times compared to the discrete counterparts [74]- [76]. Fig.…”

Section: A Integrated Componentsmentioning

confidence: 99%

GaN Power Integration for High Frequency and High Efficiency Power Applications: A Review

et al. 2020

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High frequency and high efficiency operation is one of the premier interests in the signal and energy conversion applications. The wide bandgap GaN based devices possess superior properties and have demonstrated exceeding performance than Si or GaAs devices. In order to further exploit the potential of GaN electronics, monolithic power integration is proposed. Firstly, this paper discusses the structure and properties of GaN power devices to explain the choice of lateral integration in the view of GaN power ICs. Then the state-of-the-art performance of GaN power integration in two major application areas is reviewed, which are the microwave power amplification and DC-DC power conversion. The GaN power integration technologies in MMIC platforms are summarized in terms of the gate length, operation frequency and power added efficiency of ICs. On the other hand, the smart GaN power IC platforms have boosted the development of DC-DC power converters. Demonstrations of high frequency (>1 MHz) and high efficiency (>95 %) converters with various kinds of integration technology and topology are reviewed. Lastly novel integration schemes and methods are introduced to stimulate new thoughts on GaN power integration road.

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“…16(d). The inductance can be up to several µH and the size of the system can be reduced by 5 times compared to the discrete counterparts [74]- [76]. Fig.…”

Section: A Integrated Componentsmentioning

confidence: 99%

GaN Power Integration for High Frequency and High Efficiency Power Applications: A Review

et al. 2020

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MEMS inductor fabrication and emerging applications in power electronics and neurotechnologies

et al. 2021

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MEMS inductors are used in a wide range of applications in micro- and nanotechnology, including RF MEMS, sensors, power electronics, and Bio-MEMS. Fabrication technologies set the boundary conditions for inductor design and their electrical and mechanical performance. This review provides a comprehensive overview of state-of-the-art MEMS technologies for inductor fabrication, presents recent advances in 3D additive fabrication technologies, and discusses the challenges and opportunities of MEMS inductors for two emerging applications, namely, integrated power electronics and neurotechnologies. Among the four top-down MEMS fabrication approaches, 3D surface micromachining and through-substrate-via (TSV) fabrication technology have been intensively studied to fabricate 3D inductors such as solenoid and toroid in-substrate TSV inductors. While 3D inductors are preferred for their high-quality factor, high power density, and low parasitic capacitance, in-substrate TSV inductors offer an additional unique advantage for 3D system integration and efficient thermal dissipation. These features make in-substrate TSV inductors promising to achieve the ultimate goal of monolithically integrated power converters. From another perspective, 3D bottom-up additive techniques such as ice lithography have great potential for fabricating inductors with geometries and specifications that are very challenging to achieve with established MEMS technologies. Finally, we discuss inspiring and emerging research opportunities for MEMS inductors.

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A Suspended Thick-Winding Inductor for Integrated Voltage Regulator Applications

Ding

Fang

et al. 2020

IEEE Electron Device Lett.

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A power inductor integration technology using a silicon interposer for DC-DC converter applications

Cited by 4 publications

References 11 publications

GaN Power Integration for High Frequency and High Efficiency Power Applications: A Review

GaN Power Integration for High Frequency and High Efficiency Power Applications: A Review

MEMS inductor fabrication and emerging applications in power electronics and neurotechnologies

A Suspended Thick-Winding Inductor for Integrated Voltage Regulator Applications

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