As the technology nodes scale down to 22nm and beyond, Double Patterning Lithography (DPL) has been considered as a practical solution for manufacturing process. Compared with Litho-Etch-Litho-Etch (LELE), Self-Aligned Double Patterning (SADP) has better overlay tolerance. Two types of SADP process are popularly used for the state-of-the-art lithography patterning: Spacer-Is-Dielectric (SID) and Spacer-Is-Metal (SIM). Meanwhile, Self-Aligned Quadruple Patterning (SAQP), as a natural extension of SADP, is expected to be one of the major solutions for future process requirement after the 16nm/14nm technology node. In order to have better decomposability of layout patterns, we consider SIM type SADP/SAQP during detailed routing stage. The idea of color pre-assignment is adopted and a graph model is proposed which greatly simplifies the problem and reduces design rule violation. Then, the negotiated congestion based scheme is applied for detailed routing based on our proposed graph model. Compared with other state-ofart works, our approach does not produce any side overlay error and no design rule violation is reported. Meanwhile, a better solution in terms of total wirelength, via count, routability, and runtime is achieved.
Due to the resolution limitations of optical lithography equipment, 1D gridded layout design is gaining steam. Self-aligned double patterning (SADP) is a mature technology for printing 1D layouts. However, for 20nm and beyond, SADP using a single trim mask becomes insufficient for printing all 1D layouts. A viable solution is to complement SADP with ebeam lithography. In this paper, in order to increase the throughput of printing a 1D layout, we consider the problem of e-beam shot count minimization subject to bounded line end extension constraints. Two different approaches of utilizing the trim mask and e-beam to print a layout are considered. The first approach is under the assumption that the trim mask and e-beam are used for end cutting. The second is under the assumption that the trim mask and e-beam are used to rid of all unnecessary portions. We propose elegant ILP formulations for both approaches. Experimental results show that both ILP formulations can be solved efficiently. The pros and cons of the two approaches for manufacturing 1D layout are discussed.
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