A Suspended Thick-Winding Inductor for Integrated Voltage Regulator Applications

Ding, Yixiao; Fang, Xiangming; Wu, Renbiao; Guo, Qili; Sin, J.K.O.

doi:10.1109/led.2019.2953554

Cited by 6 publications

(3 citation statements)

References 18 publications

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“…The performed analysis and presented overview of on-chip inductors might be very useful not only for IC research and development purposes but also in education and teaching, where curricula of different subjects on integrated circuit design can be complemented. [9] 2018 [25] 2019 [12] 2019 [4] Technology [19] 2020 [24] 1 2020 [14], [15] 2020 [26] 2020 [13] 2020 [5] 2020 [34] 2021 [8] 1 [16] 2021 [32] 2021 [17] 2021 [23] 1 2022 [52] 2022 [58] 1…”

Section: Overviewmentioning

confidence: 99%

Fully Integrated On-Chip Inductors: An Overview

Robert

Kovac

Richard

et al. 2022

2022 20th International Conference on Emerging eLearning Technologies and Applications (ICETA)

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This paper presents an overview and State-of-the-Art of fully integrated inductors with common fabrication processes used for implementation of these structures into a chip. The first step is an overview of fabrication technologies that starts with standard CMOS general purpose processes expanded by Far-BEOL and substrate alteration process (SOI, Silicon Embedded, TSV, TGV, PTH, Core Insertion); and continues to advanced process nodes like SMMT and Bond Wire utilization. Then, an overview of fully integrated inductor structures consists of selected topologies with notable parameters achieved in last few years. Critical parameters of integrated inductors include: inductance L DC , inductance density L A , quality factor Q, selfresonant frequency FSR and series resistance R DC . These parameters are as important as the purpose and fabrication process.

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Section: Overviewmentioning

confidence: 99%

Fully Integrated On-Chip Inductors: An Overview

Robert

Kovac

Richard

et al. 2022

2022 20th International Conference on Emerging eLearning Technologies and Applications (ICETA)

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“…A common method to fabricate thick buried oxide islands is to etch deep trenches into Si substrates followed by a SiO 2 deposition step either by PECVD 14,15 or thermal oxidation 16 . For example, the quality factor increased from 3.5 at 4.6 GHz to 7 at 7 GHz for inductors fabricated on 2µm-thick and 20-µm-thick oxide layers, respectively 16 The second approach is to induce an air gap between the winding conductors and substrate, resulting in suspended windings [17][18][19][20][21][22][23][24] . This is carried out by removing materials under the winding conductors, for example, by using sacrificial layers 25 or by etching the substrate under the inductor windings 18 .…”

Section: Rfmentioning

confidence: 99%

MEMS inductor fabrication and emerging applications in power electronics and neurotechnologies

et al. 2021

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MEMS inductors are used in a wide range of applications in micro- and nanotechnology, including RF MEMS, sensors, power electronics, and Bio-MEMS. Fabrication technologies set the boundary conditions for inductor design and their electrical and mechanical performance. This review provides a comprehensive overview of state-of-the-art MEMS technologies for inductor fabrication, presents recent advances in 3D additive fabrication technologies, and discusses the challenges and opportunities of MEMS inductors for two emerging applications, namely, integrated power electronics and neurotechnologies. Among the four top-down MEMS fabrication approaches, 3D surface micromachining and through-substrate-via (TSV) fabrication technology have been intensively studied to fabricate 3D inductors such as solenoid and toroid in-substrate TSV inductors. While 3D inductors are preferred for their high-quality factor, high power density, and low parasitic capacitance, in-substrate TSV inductors offer an additional unique advantage for 3D system integration and efficient thermal dissipation. These features make in-substrate TSV inductors promising to achieve the ultimate goal of monolithically integrated power converters. From another perspective, 3D bottom-up additive techniques such as ice lithography have great potential for fabricating inductors with geometries and specifications that are very challenging to achieve with established MEMS technologies. Finally, we discuss inspiring and emerging research opportunities for MEMS inductors.

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“…Inductors are an important part of switching power converters. These components store electrical energy [1,2]. When an inductor is operated in switching power converters, an increased power loss in the assembly is observed due to the effect of the current flowing through the inductor windings on the magnetic reversal of its core [3].…”

Section: Introductionmentioning

confidence: 99%

Design for Integrated Planar Spiral Inductor for MEMS

Benhadda

Derkaoui

Mendaz

et al. 2023

Period. Polytech. Elec. Eng. Comp. Sci.

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The main aim of this paper is to present the new design of an integrated planar spiral inductor with a new structure of an underpass to obtain a high inductance, high quality factor and minimum losses into winding and magnetic core. The performance of this structure dependent on the geometrical, electrical parameters and material properties. These parameters are calculated at 350 MHz and this is the high frequency used for MEMS applications. Furthermore, thermal analysis in inductor from finite difference method is described. The heat transfer model is based on heat conduction and heat convection. Moreover, the heat source is calculated by different losses. In addition, the simulation results from 3D finite element method using software also been presented in this paper. It is based on both the classical heat equation and certain condition limits. However, a new design of an underpass has been proposed where a via is fabricated with a circular layer. The input and output of the spiral are implanted in the same direction. In addition, the magnetic core is the solution to decrease the temperature. Finally, the results of the finite difference method are compared with simulation results from finite element method. The good agreement between the results is obtained. The proposed via and a core magnetic are responsible for enhancement the thermal behavior in integrated inductor. The result shows that the temperature of the air core inductor and magnetic core inductor could be 53 °C and 33 °C, respectively.

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A Suspended Thick-Winding Inductor for Integrated Voltage Regulator Applications

Cited by 6 publications

References 18 publications

Fully Integrated On-Chip Inductors: An Overview

Fully Integrated On-Chip Inductors: An Overview

MEMS inductor fabrication and emerging applications in power electronics and neurotechnologies

Design for Integrated Planar Spiral Inductor for MEMS

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